AEM observation of interfacial reaction layers formed between Sn-3.5Ag solder and ENIG plated Cu substrate

  • Bae Jee-Hwan (Dept. of Advanced Materials Engineering, Sungkyunkwan University) ;
  • Kang Han-Byul (Dept. of Advanced Materials Engineering, Sungkyunkwan University) ;
  • Yoon Jeong-Won (Dept. of Advanced Materials Engineering, Sungkyunkwan University) ;
  • Jung Seung-Boo (Dept. of Advanced Materials Engineering, Sungkyunkwan University) ;
  • Yang Cheol-Woong (Dept. of Advanced Materials Engineering, Sungkyunkwan University)
  • Published : 2006.08.01