Investigations of process factors in the sensitivity of embedded digital switching TSP

Effect of process factors on the sensitivity of inner-type digital switching TSP was analyzed. From these results, we have successfully fabricated inner-type digital switching TSP embedded in 3.2-inch WQVGA PLS mode LCD panel. During many factors, TFT sensor structure for reducing the PI thickness and a separation distance of $0.3{\mu}m$ between the conductive column spacer (C/S) and TFT sensor were essential. Glass thickness and main C/S density were also important factors. This technology can be applied to wide angle of view hand-held phones, personal digital assistants (PDAs), and tablet PCs.