Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
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Bridging Effect and Fatigue Crack Growth of Silicon Nitride

질화규소의 피로균열진전과 입자가교효과

  • 유성근 (나고야대학 재료기능공학과)
  • Published : 1996.11.01
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Abstract

Crack growth tests on silicon nitride have been made to clarify the crack growth characteristics under static and cyclic loading. Under constant K(K: stress intensity factor) static loading the crack growth rate in silicon nitride decreases with increasing crack extension and is finally arrested. The cack growth resistiance is largely reduced by the application of stress cycling and though the crack growth resistiacne increases with increasing of crack extension the increasing rate is much smaller under cyclic loading than under static loading.

질화규소의 균열진전시험은 정적 및 반복사중하의 균열진전특성을 명확히 밝혔다. 일정 K값의 정적하중에서 균열진전속도는 균열진전증가와 더불어 감소하고 최종적으로는 정지하였다. 또 균열진전저항은 응력반복에 의해 크게 감소하였다. 특히 균열진전저항은 균열진전증가와 더불어 증가하였고, 증가속도는 정적하중보다 반복하중하에서 훨씬 작았다.

Keywords

References

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