Machining of Diamond Films with Copper Vapor Laser

구리증기레이저를 이용한 다이아몬드막의 가공

  • 박영준 (한국과학기술연구원 박막기술연구센터) ;
  • 백영준 (한국과학기술연구원 박막기술연구센터)
  • Published : 1998.01.01

Abstract

Cutting and planarization of diamond films have been performed using copper vapor laser under air at-mosphere. Diamond films of about 350${\mu}{\textrm}{m}$ and 800 ${\mu}{\textrm}{m}$ thick have been synthesized with DC plasma assisted chemical vapor deposition. The position of a specimen has been controlled by computer-driven stage. With copper vapor laser beam of 7W cutting depth increases rapidly and saturates with increasing scan number and decreasing scan speed. 8 repetitive scans at scan speed 0.5 mm/sec produce the maximum cutting depth without focus shifting Rod-shape copper vapor laser beam can be made and used effectively in planar-ization of rough diamond surface.

Keywords

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