Abstract
Permeation behavior of the semiconductor rinsing wastewater contammg Si particles was examined by ultrafiltration using the polyolefin tubular membrane. Flux decline with time was due to the growth of Si cake deposited on the membrane surface and the pore plugging by Si particles. Cake filtration from the cross flow application is compared to the combination of pore blocking and cake filtration from the dead-end application. The cake resistance is 3.16 x $10^{12}$ -4.34 X $\times$$10^{12}$ $m^{-1}$ for the cross flow and 6.6 x $\times$$10^{12}$ -12.19 X $\times$$10^{12}$ $\times$$m^{-1}$for the dead-end flow, respectively. At the initial stage of operation, permeation flux of cross flow type was 1.7 time higher than that of the dead end flow type. Permeation flux of cross flow was about 42 e 1m2 hr and the rejection rate of Si particles was about 96 %. The average particle size of Si particle in the permeate was 20 nm.
본 연구에서는 Si 미립자를 함유한 반도체 세정폐수의 관형막을 이용한 한외여과특성을 검토하였다. 관형막의 시간변화에 따른 투과유속의 감소현상은 막표면에 형성된 케익층의 증가 및 기공막힘에 기인하며, cross flow는 케익여과에 의한 막오염 형태를 보였으나 dead-end flow는 기공막힘과 케익여과에 의한 혼합형태를 보였다. Cross Flow의 케익저항의 크기는 3.16$\times$$10^{12}$ ~4.34$\times$$10^{12}$ $m^{-1}$ 였고, dead-end flow 는 6.6 $\times$$10^{12}$ ~12.19$\times$$10^{12}$ $m^{-1}$였다. 운전초기의 흐름형태에 따른 투과유속은 cross flow 가 dead-end flow 의 약 7 배였다. Cross flow 투과유속은 약 42 $\ell$/$m^2$ hr, 용질배제율은 약 96 % 였으며, 분리막공정을 거친 투과수 중의 Si 입자의 평균크기는 20nm였다.
