Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 7 Issue 3
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- Pages.55-61
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- 2000
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
A Study on The Solderability of Micro-BGA of Sn-3.5Ag-0.7Cu
Sn-3.5Ag-0.7Cu Micro-BCA의 Soldering성 연구
Abstract
Sn-37Pb and Sn-3.5Ag-0.7Cu solder balls of 0.3 mm diameter were reflow soldered with the variation of soldering peak temperature and conveyer speed of reflow machine. The peak temperatures far soldering were changed in the range of 220~
직경 0.3 mm의 Sn-37Pb 및 Sn-3.5Ag-0.7Cu 솔더볼을 솔더링 온도와 기판의 이송속도 (conveyer speed)를 변화시켜 가며 리플로 솔더링 하였다. 리플로 솔더링 온도범위는 Sn-37Pb의 경우 220~
Keywords
- micro-BGA;
- reflow soldering;
- Pb-free solder;
- Sn-3.5Ag-0.7Cu;
- soldering condition;
- shear strength;
- intermetallic compound