한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)

  • 제17권3호
  • /
  • Pages.184-191
  • /
  • 2000
  • /
  • 1225-9071(pISSN)
  • /
  • 2287-8769(eISSN)
한국정밀공학회 (Korean Society for Precision Engineering)
권호 표지

CMP공정에서 연마결과에 영향을 미치는 패드 물성치에 관한 연구

Study on Pad Properties as Polishing Result Affecting Factors in Chemical Mechanical Polishing

  • 김형재 (부산대학교 대학원 정밀기계공학과) ;
  • 김호윤 (부산대학교 대학원 정밀기계공학) ;
  • 정해도 (부산대학교 기계공학부)
  • 발행 : 2000.03.01
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초록

Properties of pad are investigated to find the relationship between the chemical mechanical polishing(CMP) results, such as material removal rate and within wafer non-uniformity(WIWNU), and its properties. Polishing pressure is considered as important factors to affect the results, so behavior of ordinary polymer is studied to define the polishing result affecting properties of pad. Experimental setup is devised to identify the behavior of pad and several different pads are used in chemical mechanical polishing experiments to verify the correlations between pad properties and polishing results. The results indicate that the viscoelastic properties of pad had relationships with the polishing results, and shows correlation between suggested properties of pad and polishing result.

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참고문헌

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