Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Transmission Line Characteristics of Silicon Based Interconnections with Patterned Ground Shields and its Implication for RF/Microwave ICs

실리콘 공정에서 패턴으로 삭각된 접지(PGS)를 이용한 인터컨넥션의 전송선 특성분석 및 RF/초고주파 집적회로에의 응용

  • Gwak, Huk-Yong (School of Engineering, Information & Communication University) ;
  • Lee, Sang-Gug (School of Engineering, Information & Communication University) ;
  • Cho, Yun-Seok (School of CSEE, Handong University)
  • 곽혁용 (韓國情報通信大學院大學校 工學部) ;
  • 이상국 (韓國情報通信大學院大學校 工學部) ;
  • 조윤석 (韓東大學校 電算電子工學部)
  • Published : 2000.06.01
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Abstract

The integrated circuit interconnection lines are experimented with patterned ground shields (PGS) at microwave frequencies. Measurement results demonstrate that the PGS can significantly reduce the power loss through the interconnect lines over wide frequency ranges as the PGS shields the lossy silicon substrate. The transmission line characteristics of the PGS interconnect lines are analyzed and identified that the PGS reduces the wave length of the interconnect line.

초고주파에서 집적회로용 연결선(interconnect)에 PGS(Patterned Grouned Shield)를 적용하는 실험을 하였다. PGS는 신호선으로부터 비절연 실리콘 기판을 차폐시킴으로써 광대역에 걸쳐 전송선의 실리콘기판을 통한 전력손실을 크게 줄일 수 있음을 측정결과를 통해 보였다. 또한 PGS를 이용한 전송선의 특성을 분석하고 PGS가 전송선의 파장을 줄여주는 효과가 있음을 확인하였다.

Keywords

References

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