Journal of Power System Engineering (동력기계공학회지)
- Volume 5 Issue 4
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- Pages.11-17
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- 2001
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- 2713-8429(pISSN)
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- 2713-8437(eISSN)
Analysis of Temperature Distribution using Finite Element Method for SCS Insulator Wafers
유한요소법을 이용한 SCS 절연 웨이퍼의 온도분포 해석
Abstract
Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor, the size of the pressure sensor diaphragm have become smaller year by year, and a microaccelerometer with a size less than
Keywords
- Single crystal silicon;
- Temperature distribution analysis;
- Fusion bonding;
- Silicon on Insulator wafer
- 단결정 실리콘;
- 온도분포해석;
- 용융결합;
- 실리콘 절연 웨이퍼;