Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 10 Issue 3
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- Pages.29-35
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- 2003
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Effects of Microstructure on the Creep Properties of the Lead-free Sn-based Solders
미세조직이 Sn계 무연솔더의 크리프 특성에 미치는 영향
- Yoo, Jin (Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Engineering) ;
- Lee, Kyu-O (Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Engineering) ;
- Joo, Dae-Kwon (Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Engineering)
- Published : 2003.09.01
Abstract
The Sn-based lead-free solders with varying microstructure were prepared by changing the cooling rate from the melt. Bulky as-cast SnAg, SnAgCu, and SnCu, alloys were cold rolled and thermally stabilized before the creep tests so that there would be very small amount of microstructural change during creep (TS), and thin specimens were water quenched from the melt (WQ) to simulate microstructures of the as-reflowed solders in flip chips. Cooling rates of the WQ specimens were 140∼150 K/sec, and the resultant
SnAg, SnAgCu, SnCu 무연솔더합금을 주조 상태에서 냉간압연한 후 열적으로 안정화한 시편 (TS)과, 실제 솔더 범프와 유사한 미세구조의 수냉에 급속 냉각(WQ)된 시편 두가지를