Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
권호 표지
DOI QR코드

DOI QR Code

Effects of Substrate on the Characteristics of SnO2 Thin Film Gas Sensors

기판 종류에 따른 박막형 SnO2 가스 센서의 응답특성

  • Kim, Seon-Hoon (Department of Materials Science and Engineering, Photonic and Elecronic Thin Film Laboratory, Chonnam National University) ;
  • Park, Shin-Chul (Department of Materials Science and Engineering, Photonic and Elecronic Thin Film Laboratory, Chonnam National University) ;
  • Kim, Jin-Hyuk (Department of Materials Science and Engineering, Photonic and Elecronic Thin Film Laboratory, Chonnam National University) ;
  • Moon, Jong-Ha (Department of Materials Science and Engineering, Photonic and Elecronic Thin Film Laboratory, Chonnam National University) ;
  • Lee, Byung-Teak (Department of Materials Science and Engineering, Photonic and Elecronic Thin Film Laboratory, Chonnam National University)
  • 김선훈 (전남대학교 신소재공학부, 광ㆍ전자박막 연구실) ;
  • 박신철 (전남대학교 신소재공학부, 광ㆍ전자박막 연구실) ;
  • 김진혁 (전남대학교 신소재공학부, 광ㆍ전자박막 연구실) ;
  • 문종하 (전남대학교 신소재공학부, 광ㆍ전자박막 연구실) ;
  • 이병택 (전남대학교 신소재공학부, 광ㆍ전자박막 연구실)
  • Published : 2003.02.01
Download PDF
⟨ Previous Next ⟩

Abstract

Effects of substrate materials on the microstructure and the sensitivity of $SnO_2$thin film gas sensors have been studied. Various substrates were studied, such as oxidized silicon, sapphire, polished alumina, and unpolished alumina. It was observed that strong correlation exists between the electrical resistance and the CO gas sensitivity of the manufactured sensors and the surface roughness of $SnO_2$thin films, which in turn was related to the surface roughness of the original substrates. X$SnO_2$thin film gas sensor on unpolished alumina with the highest surface roughness showed the highest initial resistance and CO gas sensitivity. The transmission electron microscopy observation indicated that shape and size of the columnar microstructure of the thin films were not critically affected by the type of substrates.

Keywords

References

  1. ？G. Sberbreglier, Sensors and Actuators B23, 103 (1995) https://doi.org/10.1016/0925-4005(94)01278-P
  2. W. Gpel and K. D. Schierbaum, Sensors and Actuators, B26-27, 1 (1995) https://doi.org/10.1016/0925-4005(94)01546-T
  3. A. Gotz, I. Gracia, C. Cane and E. Lora-Tamayo, J. Micromech. Microeng., 7, 247 (1997) https://doi.org/10.1088/0960-1317/7/3/045
  4. G. J. Li and S. Kawi, Matters Letters, 34, 99 (1998) https://doi.org/10.1016/S0167-577X(97)00142-0
  5. J. -M. Kim, J. -H. Moon and B. -T. Lee, Kor. J. Mater. Res., 9, 1083 (1999)
  6. S. M. Rossnagel, J. M. Cuomo and W. D. Westwood, Handbook of Plasma Processing Technology-Fundamentals, Etching, Deposition, and Surface Interactions, Noyes publication, USA, pp. 483-517 (1990)
  7. Z. Jin, H. Zhou, Z. Jin, R. Savinell and C. Liu, Sensors and Actuators, B52, 188 (1998)
  8. M. Schweiser-Berberich, J. G. Zheng, U. Weimar, W. Gpel, N. Brsan, E. Pentia and A. Tomescu, Sensors and Actuators, B31, 71 (1996) https://doi.org/10.1016/0925-4005(96)80018-9
  9. C. Xu, J. Tamaki, N. Miura and N. Yamaze, Sensors and Actuators, B3, 147 (1991) https://doi.org/10.1016/0925-4005(91)80207-Z