한국표면공학회지 (Journal of the Korean institute of surface engineering)

  • 제37권2호
  • /
  • Pages.86-91
  • /
  • 2004
  • /
  • 1225-8024(pISSN)
  • /
  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
권호 표지

Potassium formate, Glycine, Oxalic acid가 황화물계 3가 크롬도금층의 조성과 전류효율에 미치는 영향

Effect of Potassium Formate, Glycine and Oxalic Acid in Sulfate Bath on Trivalent Chromium Deposition Composition and Current Efficiency

  • 김만 (한국기계연구원 표면연구부) ;
  • 김대영 (한국기계연구원 표면연구부) ;
  • 박상언 (한국기계연구원 표면연구부) ;
  • 권식철 (한국기계연구원 표면연구부) ;
  • 최용 (선문대학교 신소재생명화학공학부)
  • Kim, Man (Department of Surface Engineering, Korea Institute of Machinery & Materials) ;
  • Kim, Dae-Young (Department of Surface Engineering, Korea Institute of Machinery & Materials) ;
  • Park, Sang-Eon (Department of Surface Engineering, Korea Institute of Machinery & Materials) ;
  • Kwon, Sik-Chul (Department of Surface Engineering, Korea Institute of Machinery & Materials) ;
  • Choi, Yong (Division of Advanced Materials and Bio-Chemical Engineering, Sunmoon University)
  • 발행 : 2004.04.01
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초록

Effect of potassium formate, glycine and oxalic acid in a sulfate solution on the deposit composition and current efficiency of trivalent chromium plating was studied. The trivalent chromium layers prepared by solutions with potassium formate, glycine and oxalic acid contain a few carbon inside. The solutions containing potassium formate, glycine and oxalic acid are relatively stable with pH change. The solution with the potassium formate shows 6-30％ current efficiency with current density, whereas, the solutions with oxalic acid and glycine show about 5％ current efficiency, respectively. The improved current efficiency is related to enough supply of chromium ions to the electrode due to the increase of pH at the front of electrode.

키워드

참고문헌

  1. Zhenmi Tu et al., Plating and Surface Finishing, 80 (1993) 79
  2. T. Pearson et al., Trans. IMF, 76(6) (1998) 883
  3. M. Takaya et al., Plating and Surface Finishing, 74 (1987) 90
  4. M. El. Sharif et al., Trans. IMF, 73(1) 1995, 19 https://doi.org/10.1080/00202967.1995.11871049
  5. Morikawa et al., 表面技術, 42 (1991) 95
  6. 김동수 외, 한국표면공학회지, 34 (2001) 49
  7. T. Tsuru et al., 表面技術, 34 (1983) 493
  8. Y. B. Song et al., Electrochimica Acta, 48 (2002) 349 https://doi.org/10.1016/S0013-4686(02)00678-3
  9. S. K. Ibrahim et al., Trans IMF, 75(5) (1997) 181 https://doi.org/10.1080/00202967.1997.11871169
  10. N. V. Mandich, Plating and Surface Finishing, 84 (1997) 108
  11. D. J. Barclay et al., US PATENT 4,472,250, (1984)