Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
권호 표지

Longitudinal Ultrasonic Bonding of Strip-type Au Bumps

스트립 형상인 Au 범프의 종방향 초음파 접합

  • 김병철 (한국과학기술원, 기계공학과) ;
  • 김정호 (한국과학기술원, 기계공학과) ;
  • 이지혜 (한국과학기술원, 기계공학과) ;
  • 유중돈 (한국과학기술원, 기계공학과) ;
  • 최두선 (한국기계연구원, 지능형 정밀기계연구부)
  • Published : 2004.06.01
Download PDF
⟨ Previous Next ⟩

Abstract

The strip Au bumps are bonded using longitudinal ultrasonic far the electronic package. Au bumps on the chip and substrate are aligned in a crossed shape, and the ultrasonic is imposed on the chip to form the solid-state bond between the Au bumps. Deformed bump shapes are calculated using the finite element method, and the bond strength is measured experimentally. The crossed strip Au bumps are deformed similar to the saddle, which provides larger contact surface area and higher friction force. Compared with the previous bonding method between the Au bump and planar pad, higher bond strength is obtained using the crossed strip bumps.

Keywords

References

  1. Fundamentals of Microfabrication M.J.Madou
  2. IEEE Proc. Multi-Chip Module Conference Yield modeling of MCM assembly with Flip-Chip Thermocompression bonding S.Y.Kang;Y.C.Lee
  3. IEEE Proc. Electronic Components and Technology Conference Thermosonic Bonding: An Alternative to Area-Array Solder Connections S.Y.Kang;T.H.Ja;Y.C.Lee
  4. IEEE Proc. Multi-Chip Module Conference Thermosonic Bonding for Flip-Chip Assembly S.Y.Kang;T.McLaren;W.Zhang;Y.C.Lee
  5. IEEE Trans. on components, packaging, and manufacturing technology-Part B v.18 no.4 Modeling and Experimental Studies on Thermosonic Flip-Chip Bonding S.Y.Kang;P.M.Williams;Y.C.Lee https://doi.org/10.1109/96.475282
  6. IEEE Proc. Electronic Components and Technology Conference, 51st evelopment of gold to gold interconnection flip chip bonding for chip on suspension assemblies C.F.Luk;Y.C.Chan;K.C.Hung
  7. IEEE Trans. on advanced Packaging v.23 no.3 Thermosonic flip-chip bonding system with a self-planarization feature using polymer Q.Tan;B.Schaible;L.J.Bond;Y.C.Lee
  8. IEEE Trans. on components, packaging, and manufacturing technology-Part B v.21 no.2 Thermosonic flip-chip bonding using longitudinal ultrasonic vibration Q.Tan;W.Zhang;B.Schaible;Leonard J.Bond;T.H.Ju;Y.C.Lee https://doi.org/10.1109/96.659506
  9. IEEE Micro Electro Mechanical Systems v.15 Ultrasonic bonding of In/Au and AI/AI for hermitic sealing of MEMS packaging J.B.Kim;M.Chiao;L.Lin
  10. IEEE trans. on sonics and ultrasonics v.SU-13 no.1 Effects of ultrasound on deformation characteristics of metals B.Langenecker
  11. Ultrasonic rolling and drawing of metals V.P.Severdenko;V.V.Klubovich;A.V.Klubovich
  12. Mechanics of Plastic Deformation in Metal Processing E.G.Thomsen;C.T.Yang;S.Kobayashi