Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Techniques for Measuring Mechanical Properties of Polysilicon using an ISDG

ISDG를 이용한 다결정실리콘 기계적 물성값 측정법

  • 오충석 (금오공과대학교 기계공학부)
  • Published : 2004.07.01
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Abstract

Techniques and procedures are presented for measuring mechanical properties on thin-film Polysilicon. Narrow platinum lines are deposited 250 ${\mu}{\textrm}{m}$ apart on tensile specimens that are 3.5 ${\mu}{\textrm}{m}$ thick and 600 ${\mu}{\textrm}{m}$ wide. Load is applied by a piezo-actuator and by hanging weights. Strain is measured by an ISDC at temperatures up to 500 $^{\circ}C$. Measurements of the elastic modulus with jig modifications, loading speed and temperature change are presented first. And then, the preliminary data for the coefficient of thermal expansion and creep behavior are presented as a reference.

Keywords

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