Journal of Mechanical Science and Technology

  • 제18권9호
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  • Pages.1572-1581
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  • 2004
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  • 1738-494X(pISSN)
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  • 1976-3824(eISSN)
대한기계학회 (The Korean Society of Mechanical Engineers)
권호 표지

Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer

  • Yang, Ji-Hyuck (Hyundai Motor Company) ;
  • Lee, Kang-Yong (School of Mechanical Engineering, Yonsei University) ;
  • Dong, C. Y. (School of Mechanical Engineering, Yonsei University)
  • 발행 : 2004.09.01
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초록

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

키워드

참고문헌

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