DOI QR코드

DOI QR Code

Reliability Assessment of MEMS Gyroscope Sensor

MEMS 자이로스코프 센서의 신뢰성 문제

  • 최민석 (삼성종합기술원 MEMS Lab.) ;
  • 좌성훈 (삼성종합기술원 MEMS Lab.) ;
  • 김종석 (삼성종합기술원 MEMS Lab.) ;
  • 정희문 (삼성종합기술원 MEMS Lab.) ;
  • 송인섭 (삼성종합기술원 MEMS Lab.) ;
  • 조용철 (삼성종합기술원 MEMS Lab.)
  • Published : 2004.09.01

Abstract

Reliability of MEMS devices is receiving more attention as they are heading towards commercial production. In particular are the reliability and long-term stability of wafer level vacuum packaged MEMS gyroscope sensors subjected to cyclic mechanical stresses at high frequencies. In this study, we carried out several reliability tests such as environmental storage, fatigue, shock, and vibration, and we investigated the failure mechanisms of the anodically bonded vacuum gyroscope sensors. It was found that successful vacuum packaging could be achieved through reducing outgassing inside the cavity by deposition of titanium as well as by pre-taking process. The current gyroscope structure is found to be safe from fatigue failure for 1000 hours of operation test. The gyroscope sensor survives the drop and vibration tests without any damage, indicating robustness of the sensor. The reliability test results presented in this study demonstrate that MEMS gyroscope sensor is very close to commercialization.

Keywords

References

  1. Miiller-Fiedler, R., Wanger, U., Bernhard, W., 2002, 'Reliability of MEMS-a Methodical Approach', Microelectronics Reliability, Vol. 42, pp. 1771-1776 https://doi.org/10.1016/S0026-2714(02)00229-9
  2. Putty, M., Najafi, K., 1994, 'A Micromachined Vibrating Ring Gyroscope,' In: Technical Digest, Solid-State Sensor and Actuator Workshop, Hilton Head Island. SC, USA, pp. 213-220
  3. Hwang, K. H., Lee, K. H., Park, G. J., Lee, B. L., Cho, Y. C, Lee, S. H., 2002, 'Robust Design of the Vibratory Gyroscope with Unbalanced Inner Torsion Gimbal Using Axiomatic Design,' Trans. of KSME (A), Vol. 26, No. 2, pp. 914-923
  4. Kobayashi, S., Hara, T., Oguchi, T., Asaji, Y, Yaji, K., Ohwada, K., 1999, 'Double-Frame Silicon Gyroscope Packaged Under Low Pressure by Wafer Bonding,' In: Transducers'99, Sendai, Japan, pp. 910-913
  5. Corman, T, Enoksson, P., Stemme, G, 1997, 'Gas Damping of Electrostatically Excited Resonators,' Sensors and Actuators, Vol. A 61, pp. 249~255 https://doi.org/10.1016/S0924-4247(97)80270-1
  6. Esashi, M., Ura, N., Matsumoto, Y, 1992, 'Anodic Bonding for Integrated Capacitive Sensors,' In: Proc. Micro Electro Mechanical Systems '92, pp. 43-48 https://doi.org/10.1109/MEMSYS.1992.187688
  7. Mack, S., Baumann, H., Gosele, U., 1996, 'Gas Development at the Interface of Directly Bonded Silicon Wafers: Investigation on Silicon-Based Pressure Sensors,' Sensors and Actuators, Vol. A56, pp. 237-277 https://doi.org/10.1016/S0924-4247(96)01320-9
  8. Lee, B. L., Lee, S. W., Jung, K. D., Choi, J. H., Chung, T. R., and Cho, Y C, 2001, 'A De-Couple Vibratory Gyroscope Using a Mixed Micro-Machining Technology,' In: Proc. 2001 IEEE International Conference on Robotics & Automation, Seoul, Korea, pp. 3412-3416
  9. Greenhouse, H., 1999, Hermeticity of Electronic Packages, William Andrew Publishing, New York
  10. Nese, M., Bernstein, R. W., Johansen, I. R., Spooren, R., 1996, 'New Method for Testing Hermeticity of Silicon Sensor Structures,' Sensors and Actuators, Vol. A53, pp.349~352 https://doi.org/10.1016/0924-4247(96)80159-2
  11. Jourdain, A., De Moor, P., Pamidighantam, S., Tilmans, H. A. C., 2002, 'Investigation of the Hermeticity of BCB-Sealed Cavities for Hours (RF-) MEMS Devices,' The Fifteenth IEEE International Conference on Micro Electro Mechanical Systems, pp. 677-680 https://doi.org/10.1109/MEMSYS.2002.984361
  12. Tao, Y, Malshe, A. P., Brown, W. D., 2004, 'Selective Bonding and Encapsulation for Wafer-Level Vacuum Packaging of MEMS and Related Micro System,' Microelectronics Reliability, Vol. 44, pp. 251-258 https://doi.org/10.1016/S0026-2714(03)00192-6
  13. Mack, S., Baumann, H., Gosele, U., Werner, H., Schlogl, R., 1997, 'Analysis of Bonding-Related Gas Enclosure in Micromachined Cavities Sealed by Silicon Wafer Bonding,' J. Electrochem., Vol. 144, No. 3, pp. 1106-1110 https://doi.org/10.1149/1.1837540
  14. Cheng, Y. T, Hsu, W T, Najafi, K., Nguyen, C. T. C, Lin, L., 2002, 'Vacuum Packaging Technology Using Localized Alurninum/Silicon-to-Glass Bonding,' J. of Microelectromechanical Systems, Vol. 11, No. 50, pp. 556-565 https://doi.org/10.1109/JMEMS.2002.802903
  15. Gendt, S. D., Snee, I., Cornelissen, I., Lux, M., Vos, R., Mertens, P. W, Knotter, D. M., Heyns, M. M., 1998, 'A Novel Resist and Post-etch Residue Removal Process Using Ozonated Chemistries,' In: 1998 Symposium on VLSI Technology Digest of Technical Papers, pp. 168-169 https://doi.org/10.1109/VLSIT.1998.689243
  16. Cheng, Y T., Hsu, W. T, Najafi, K., Nguyen, C. T. C, Lin, L., 2002, 'Vacuum Packaging Technology Using Localized Aluminum/Silicon-to-Glass Bonding,' J. of Microelectromechanical systems, Vol. 11, No. 50, pp. 556-565 https://doi.org/10.1109/JMEMS.2002.802903
  17. Minami, K., Moriuchi, T., Esashi, M., 1995, 'Cavity Pressure Control for Critical Damping of Packaged Micro Mechanical Devices,' In: Transducer'95 8th Int. Conf. on Solid-State Sensors and Actuators, Stockholm, Sweden, June, pp. 240-243 https://doi.org/10.1109/SENSOR.1995.717155
  18. Benvenuti, C, Chiggiato, P., Cicoira, F., L'Aminot, Y, 1998, 'Nonevaporable Getter Films for Ultrahigh Vacuum Applications,' J. Vac. Sci. Technol, Vol. 16, No. l,pp. 148-154 https://doi.org/10.1116/1.580963
  19. Muhlstein, C. L., Brown, S. B., Ritchie, R. O., 2001, 'High-Cycle Fatigue and Durability of Polycrystalline Silicon Thin Films in Ambient Air. Sensors and Actuator,' Vol. A 94, pp. 177-188 https://doi.org/10.1016/S0924-4247(01)00709-9
  20. Muhlstein, C. L., Brown, S. B., Ritchie, R. O., 2001, 'High-Cycle Fatigue of Single-Crystal Silicon Thin Films,' J. of Microelectromechanical Systems, Vol. 10, No. 4, pp. 593-600 https://doi.org/10.1109/84.967383
  21. Brown, S. B., Van Arsdell, W., Muhlstein, C. L., 1997, 'Material Reliability in MEMS Devices,' In: Proc. of Transducer'97, Int. Conf. on Solid-State Sensors and Actuators, Chicago, USA, April, pp. 591-593 https://doi.org/10.1109/SENSOR.1997.613720
  22. Muhlstein, C. L., Howe, R. T, Ritchie, R. O., 2004, 'Fatigue of Polycrystalline Silicon for Microelectromechanical System Applications: Crack Growth and Stability Under Resonant Loading Conditions,' Mechanics of Materials, Vol. 36, pp. 13-33 https://doi.org/10.1016/S0167-6636(03)00028-0
  23. Tanner, D. M., Walraven, J. A., Helgesen, K. S., Irwin, L.W., 2000, 'MEMS Reliability in a Vibration Environment,' In: Proc. IEEE International Reliability Physics Symposium, San Jose, CA, April, pp. 139-145 https://doi.org/10.1109/RELPHY.2000.843904
  24. Wagner, U., Franz, J., Schweiker, M., Bernhard, W., Muller-Fiedler, R, Michel, B., Paul, O., 2001, 'Mechanical Reliability of MEMS-Structures Under Shock Load. Microelectronics Reliability,' Vol. 41, pp. 1657-1662 https://doi.org/10.1016/S0026-2714(01)00173-1