References
- J. Y. Dai, Z. R. Guo, S. F. Tee, C. L. Tay, E. Er and S. Redkar, Appl. Phys. Lett., 78, 3091 (2001) https://doi.org/10.1063/1.1372621
- J. Prokop, C. E. Zybill and S. Veprek, Thin Solid Films, 359, 39 (2000) https://doi.org/10.1016/S0040-6090(99)00654-9
- C. Detavernier, R. L. Van Meirhaeghe and F. Cardon, J. Appl. Phys., 88, 133 (2000) https://doi.org/10.1063/1.373633
- J. Chen, J. P. Colinge, D. Flandre, R. Gillon, J. P. Raskin and D. Vanhoenacker, J. Electrochem. Soc., 144(7), (1997) https://doi.org/10.1149/1.1837833
- J. J. Sun, J. Y. Tsai and C. M. Osburn, IEEE Transactions on Electron Devices, 45(9), 1946 (1998) https://doi.org/10.1109/16.711360
- S. M. Sze, VLSI Technology Digest, John Wiley & Sons (1998)
- SIA Roadmap
- S. L. Hsia, T. Y Tan, P. Smith and G. E. McGuire, J. Appl. Phys., 88, 133 (2000) https://doi.org/10.1063/1.373633
- J. B. Lasky, J. S. Nakos, O. J. Cain and P. J. Geiss, IEEE Trans. Electron Devices, 38, 262 (1991) https://doi.org/10.1109/16.69904
- F. H. Ko, H. C. You, T. C. Chu, T. F. Lei, C. C. Hsu and H. L. Chen, Microelectronics Engineering, in Press (2004)
- O. O. Awadelkarim, S. J. Fonash, P. I. Mikulan, M. Ozaita and Y. D. Chan, Microelectronics Engineering, 28, 1-4,47 (1995) https://doi.org/10.1016/0167-9317(95)00013-X
- P. Xuan and J. Bokor, IEEE Electron Device Lett., 24(10), 634 (2003) https://doi.org/10.1109/LED.2003.817371
- J. Lutze, G. Scott and M. Manley, IEEE Electron Device Lett., 21(4), 155 (2000) https://doi.org/10.1109/55.830966
- H. Fang, M. C. Oztu, E. G. Seebauer and D. E. Batchelor, J. Electrochem. Soc., 146(11) 4240 (1999) https://doi.org/10.1149/1.1392621
- R. T. Tung, Applied Surface Science, 117/118, 268 (1997) https://doi.org/10.1016/S0169-4332(97)80092-X
- H. Zhang, J. Poole, R. Eller and M. Keefe, J. Vac. Sci. Technol. A, 17, 1904 (1999) https://doi.org/10.1116/1.581702
- M. L. A. Dass, D. B. Fraser and C. S. Wei, Appl. Phys. Lett, 58, 1308 (1991) https://doi.org/10.1063/1.104345
- A. Vantomme, M. A. Nicolet and N. D. Theodore, J. Appl. Phys., 75, 3882 (1994) https://doi.org/10.1063/1.356033
- S. H. Cheong and O. S. Song, Korean Journal of Materials Research, 13(11), 711 (2003) https://doi.org/10.3740/MRSK.2003.13.11.711
- S. H. Cheong and O. S. Song, Korean Journal of Materials Research, 13(2). 88 (2003) https://doi.org/10.3740/MRSK.2003.13.2.088
- S. K. Saha, R. S. Howell, M. K. Hatalis, Thin Solid Films, 347, 278 (1999) https://doi.org/10.1016/S0040-6090(99)00013-9