한국재료학회지 (Korean Journal of Materials Research)

  • 제15권3호
  • /
  • Pages.183-188
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  • 2005
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  • 1225-0562(pISSN)
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  • 2287-7258(eISSN)
한국재료학회 (Materials Research Society of Korea)
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웨이퍼의 2단 이면공정이 반도체 칩의 휨 강도에 미치는 영향

The Effect of Dual Wafer Back-Lapping Process on Flexural Strength of Semiconductor Chips

  • 이성민 (인천대학교 신소재공학부)
  • Lee Seong Min (Department of Materials Science & Engineering, University of Incheon)
  • 발행 : 2005.03.01
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초록

It was studied in this article how the flexural strength of bare silicon chips is influenced by adopting dual wafer back-lapping process. The experimental results showed that an additional finishing process after the conventional grinding process improves the flexural strength of bare chips by more than 2-fold. In particular, this work showed that the proper removal of the grinding marks$(Ra=0.1\;{\mu}m)$existing on the wafer back-surface resulting from the grinding process significantly contiributes to the enhancement of chip strength.

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참고문헌

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