깊은 구멍 가공을 위한 가공액 초음파 가진 미세 방전가공

Micro EDM with Ultrasonic Work Fluid Vibration for Deep Hole Machining

  • 제성욱 (LG전자 생산기술연구원) ;
  • 이해성 (서울대학교 대학원 정밀기계설계공동연구소) ;
  • 주종남 (서울대학교 기계항공공학부) ;
  • 김덕환 (서울대학교 기계항공공학부)
  • 발행 : 2005.07.01

초록

Microholes with high aspect ratio are required in microstructures. Among various methods for producing the microhole, micro electrical discharge machining (MEDM) is very effective and useful process. But, it is difficult to machine the high aspect ratio holes below $100\;{\mu}m$ in diameter because machining condition becomes unstable due to bad removal of debris at deep hole. In this paper, ultrasonic vibration is applied to MEDM work fluid to make a high aspect ratio micro hole. It is shown that the vibration is effective in circulating the debris and increasing the machining rate. As a result, produced was a micro hole with $92\;{\mu}m$ entrance diameter, $81\;{\mu}m$ exit diameter and aspect ratio 23.

키워드

참고문헌

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