Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
권호 표지
DOI QR코드

DOI QR Code

Characteristic of Copper Films on PET Substrate Deposited by Cyclic Operation of RF-magnetron-sputtering Coupled with Continuous Operation of ECR-CVD

연속 ECR-CVD 조업하에 RF-magnetron-sputter의 싸이클조업을 통해 PET위에 올려진 구리박막의 특성

  • Myung JongYun (Dept. of Materials Science & Engineering, Korea University) ;
  • Jeon Bupju (Eco-nano Research Center, Korea Institute of Science and Technology) ;
  • Byun Dongjin (Dept. of Materials Science & Engineering, Korea University) ;
  • Lee Joongkee (Eco-nano Research Center, Korea Institute of Science and Technology)
  • 명종윤 (고려대학교 재료공학과) ;
  • 전법주 (한국과학기술연구원 나노환경연구센터) ;
  • 변동진 (고려대학교 재료공학과) ;
  • 이중기 (한국과학기술연구원 나노환경연구센터)
  • Published : 2005.07.01
Download PDF
⟨ Previous Next ⟩

Abstract

Preparation of copper film on PET substrate was carried out by cyclic operation of RF-magnetron­sputtering under continuous operation of ECR-CVD. The purpose of this study is aimed to an increase in deposition rate with keeping excellent adhesion between copper film and PET. In order to optimize the sputtering time under continuous ECR-CVD, cyclic operation concept is employed. By changing parameters of cyclic operation such as split of e and cycle time of A, the characteristics and thickness of the deposited copper film are controlled. As $\theta$ value increase, film thickness could confirm to increase and its surface resistivity value decreases. The highest adhesive strength appears at $\theta=0.33$ and cycle time of 30 min. The uniformity of copper film shows $5\%$ in our experimental range.

Keywords

References

  1. T. Lim, Y. Huh and T. Park, The Korean J. of Chem. Eng., 32(3), 332 (1994)
  2. J. Kurdi, H. Ardelean, P. Marcus, P. Jonnard and F. Arefikhonsari, Appl. Sur. Sci., 189, 119 (2002) https://doi.org/10.1016/S0169-4332(02)00017-X
  3. J. F. Silvain and J. J. Ehrhardt, 236, 230 (1993) https://doi.org/10.1016/0040-6090(93)90675-F
  4. R. Cueff, G. Band, M. Benmalek, J. P. Besse, J. R Butruille, H.M. Dunlop and M Jacquet, Thin Solid Films, 270, 230 (1995) https://doi.org/10.1016/0040-6090(95)06917-8
  5. M. Paligova, J. Vilkacova, P. Saha, V. Kresalek, J. Stejskal and O. Quadrat, Pysica, A335, 421 (2004)
  6. I. Park, KAIST Ph.D. dissertation, 1991, pp. 1-2
  7. V. W. L Lim, E. T. Kang and K.G. Neoh Synthetic Metals, 123, 107 (2001) https://doi.org/10.1016/S0379-6779(00)00592-0
  8. E. Lugscheider, K. Bobzin, M. Maes and A. Kramer, Thin Solid Films, 459, 313 (2004) https://doi.org/10.1016/j.tsf.2003.12.134
  9. L. Martin, J Esteve and S. Boross, Thin Solid Films, 451-452, 74 (2004) https://doi.org/10.1016/j.tsf.2003.11.149
  10. S. Kim, J.-M. Park and D.-J. Choi, Thin Solid Films, 320, 95 (1998) https://doi.org/10.1016/S0040-6090(97)01075-4
  11. S. Gu, P. Atanasova, M. J. Hampden-Smith and T. T. Kodas, 340, 45 (1999) https://doi.org/10.1016/S0040-6090(98)01401-1
  12. C. A. Outten, J. C. Barbour and W. R, Wampler, J. Vac. Sci. Technol., A 9(3), 717 (1991) https://doi.org/10.1116/1.577350
  13. S. Matsuo and M. Kiuchi, Jpn. J. Appl. Phys., 22(4), L210 (1983) https://doi.org/10.1143/JJAP.22.L210
  14. J. Asmussen : 'Hand book of plasma processing technology', Rossnagel, S. M., Cuomo, J. J. and Westwood, W. D.(ed.), Noyes Publication, Park Ridge (New Jergy), 1990 p.285
  15. S. Matsuo: 'Handbook of Thin film Deposition Processes and techniques', K. Schuegraft(ed.) Noyes Publication, Park Ridge, New Jergy, 1988, p.147
  16. C. Oehr and H. Suhr, Appl. phys., A45, 151 (1998) https://doi.org/10.1007/BF02565202
  17. T. T. Kodas and M. J. Hamden-smith, J. of Organometallic Chemistry, 522, 161 (1996)
  18. J-W. Lim, K. Mimura and M. Isshiki, Appl. Sur. Sci., 217, 95 (2003) https://doi.org/10.1016/S0169-4332(03)00522-1
  19. Y. Fujinami, H. Hayashi, A. Ebe, O. Imai, K. I Ogata, Mat. Chem. and phys., 54, 102 (1998) https://doi.org/10.1016/S0254-0584(98)00094-7