Tribology and Lubricants

Korean Tribology Society (한국트라이볼로지학회)
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Evaluation of Mechanical Properties and FEM Analysis on Thin Foils of Copper

구리 박막의 기계적 물성 평가 및 유한요소 해석

  • 김윤재 (고려대학교 기계공학과) ;
  • 안중혁 (고려대학교 기계공학고 대학원) ;
  • 박준협 (동명정보대학교 메카트로닉스공학과) ;
  • 김상주 (서울시립대학교 기계정보학과) ;
  • 김영진 (성균관대학교 기계공학부) ;
  • 이영제 (성균관대학교 기계공학부)
  • Published : 2005.04.01
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Abstract

This paper compares of mechanical tensile properties of 6 kinds of copper foil. The beam lead made with copper foil. Different from other package type such as plastic package, Chip Size Package has a reliability problem in beam lead rather than solder joint in board level. A new tensile loading system was developed using voice-coil actuator. The new tensile loading system has a load cell with maximum capacity of 20 N and a non-contact position measuring system based on the principle of capacitance micrometry with 0.1nm resolution for displacement measurement. Strain was calculated from the measured displacement using FE analysis. The comparison of mechanical properties helps designer of package to choose copper for ensuring reliability of beam lead in early stage of semiconductor development.

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References

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