Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Thermal Shock Cycles Optimization of Sn-3.0 Ag-0.5 Cu/OSP Solder Joint with Bonding Strength Variation for Electronic Components

Sn-3.0 Ag-0.5 Cu/OSP 무연솔더 접합계면의 접합강도 변화에 따른 전자부품 열충격 싸이클 최적화

  • Hong, Won-Sik (Reliability and Failure Analysis Center, Korea Electronics Technology Institute) ;
  • Kim, Whee-Sung (Department of Materials Engineering, Hankuk Aviation University) ;
  • Song, Byeong-Suk (Reliability and Failure Analysis Center, Korea Electronics Technology Institute) ;
  • Kim, Kwang-Bae (Department of Materials Engineering, Hankuk Aviation University)
  • 홍원식 (전자부품연구원 신뢰성평가센터) ;
  • 김휘성 (한국항공대학교 항공재료공학과) ;
  • 송병석 (전자부품연구원 신뢰성평가센터) ;
  • 김광배 (한국항공대학교 항공재료공학과)
  • Published : 2007.03.27
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Abstract

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

Keywords

References

  1. J. W. Kim, D. G Kim, W. S. Hong and S. B. Jung, J. Elec. Mater., 34(12), 1550 (2005) https://doi.org/10.1007/s11664-005-0164-8
  2. J. W. Yoon, and S. B. Jung, J. Alloys and Compounds, 396, 122 (2005) https://doi.org/10.1016/j.jallcom.2004.12.009
  3. D. G. Kim., J. W. Kim, J. G. Lee, H. Morib, D. J. Quesnel, and S. B. Jung, J. Alloys and Compounds, 395, 80 (2005) https://doi.org/10.1016/j.jallcom.2004.11.038
  4. J. W. Yoon, S. W. Kim, and S. B. Jung, J. Alloys and Compounds, 392, 247 (2005) https://doi.org/10.1016/j.jallcom.2004.09.045
  5. J. W. Yoon, S. W. Kim, and S. B. Jung, J. Alloys and Compounds, 391, 82 (2005) https://doi.org/10.1016/j.jallcom.2004.09.001
  6. J. W. Yoon, D. G. Kim, and S. B. Jung, Microelectron. Reliab., 46, 535 (2006) https://doi.org/10.1016/j.microrel.2005.06.008
  7. C. Gur and M. Bamberger, Acta Mater., 46(14), 4917 (1998) https://doi.org/10.1016/S1359-6454(98)00192-X
  8. C. J. Chen and K. L. Lin, J. Elec. Mater., 29, 1007 (2000) https://doi.org/10.1007/s11664-000-0165-6
  9. W. S. Hong, and K. B. Kim, Kor. J. Mater. Res., 15(8), 536 (2005) https://doi.org/10.3740/MRSK.2005.15.8.536
  10. K. Suganuma, Lead free soldering in electronics, p.57, Marcel Dekker Inc., New York (2004)
  11. JEITA, Lead Free Soldering Tech., Corona Pub. Co. Ltd., Tokyo (2003)
  12. K. N. Tu, C. C. Yeh, C. Y. Liu, and C. Chen, Appl. Phys. Lett., 76, 988 (2000) https://doi.org/10.1063/1.125915
  13. R. Strauss, SMT Soldering Handbook, 2nd ed., p.148, Newnes, Oxford (1998)

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  3. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics vol.45, pp.12, 2016, https://doi.org/10.1007/s11664-016-4837-2