References
- Z. Liu and Y. Su, K. Varahramyan, Thin Solid Films, 478, 275 (2005) https://doi.org/10.1016/j.tsf.2004.11.077
- Y. B. Park, I. S. Park and J. Yu, Mater. Sci. Eng., A266, 261 (1999) https://doi.org/10.1016/S0921-5093(98)01117-4
- Y. B. Park and J. Yu, Met. Mater. Int., 7(2), 123 (2001) https://doi.org/10.1007/BF03026950
- J. Y. Song and J. Yu, Acta Mater., 50, 3985 (2002) https://doi.org/10.1016/S1359-6454(02)00197-0
- M. H. Kim and K. W. Lee, Met. Mater. Int., 12(5), 425 (2006) https://doi.org/10.1007/BF03027710
- S. H. Kim, S. W. Na, N. -E. Lee, Y. W. Nam and Y. H. Kim, Surf. Coat. Technol., 200, 2072 (2005) https://doi.org/10.1016/j.surfcoat.2005.05.021
- S. B. Lee, Y. K. Kim and J. S. Kim, Kor. J. Mater. Res., 16(9), 543 (2006) https://doi.org/10.3740/MRSK.2006.16.9.543
- K-S. Kim and N. Aravas, Int. J. Sol. Struct., 24(4), 417 (1988) https://doi.org/10.1016/0020-7683(88)90071-6
- A. J. Kinloch, C. C. Lau and J. G. Williams, Int. J. Frac., 66(1), 45 (1994) https://doi.org/10.1007/BF00012635
- C. D. Wagner, W. M. Riggs, L. E. Davis and J. F. Moulder, Handbook of X-ray Photoelectron Spectroscopy, Perkin-Elmer Corporation, Eden Prairie, MN, U. S. A., (1978)
- O. D. Greenwood, R. D. Boyd, J. Hopkins and J. P. S. Badyal, J. Adhesion Sci. Techol., 9(3), 311 (1995) https://doi.org/10.1163/156856195X00527
- L. J. Gerenser, J. Vac. Sci. Technol. A, 6(5), 2897 (1988) https://doi.org/10.1116/1.575448
- S. C. Park, S. W. Cho, H. C. Jung, J. W. Joung and Y. B. Park, Proceeding of the 2006 fall technical symposium on microelectronics and packaging, 29 (2006)
- Adley F. Rubira, James D. Rancourt, Maggie L. Caplan, Anne K. St. Clair and Larry T. Taylor, Chem. Mater., 6, 2351 (1994) https://doi.org/10.1021/cm00048a022
- D. Hu and H. Chen, J. Mater. Sci., 27, 5262 (1992) https://doi.org/10.1007/BF02403827
- Y. H. Kim, Master Thesis., Seoul National University, (2006)
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