References

1. Charles A. Harper, Electronic Packaging & interconnection Handbook, Second Edition, McGraw Hill, 1997
2. Engelmeier, W., 'Surface Mount Solder Joint Reliability: Issue, Design, Testing, Prediction' Workshop Notes, Engelmaier Associate, Inc., Mendahm, NJ, 1995
3. Dave S. Steinburg, Vibration Analysis for Electronic Equipment, Second Edition, Wiley Inter-Science, 1980
4. John W. Miles, 'On Structural Fatigue Under Random Loading', Journal of the Aeronautical Science, pp.753, 1954 https://doi.org/10.2514/8.3199
5. John Parry, Chris Bailey, Chris Aldham, 'Multiphysics Modeling for Electronic Design', Proceedings of ITHERM Conference, Las Vegas, May 2000, pp.86-93
6. R. Darveaux et al., 'Solder Joint Fatigue Life Model', Design and Reliability of Solders and Solder Interconnection, 1997, pp.213-218, Pub. TMS
7. H. Lu, C. Bailey, M. Dusek, C. Hunt and J. Nottay, 'Modeling the Fatigue Life Prediction of Solder Joints for Surface Mount Resistor', International Symposium on Electronic Materials and Packaging, Hong Kong, pp. 136-143, Pub. IEEE, ISBN 0-7803-6654-9, 2000
8. Military Specification Microcircuits, Linear, Adjustable, Positive, Voltage Regulators, Monolithic Silicon, MIL-M-38510/117A, March 1980