Manufacture and Properties of Water Soluble Acrylic Type PSA's - Effect of Functional Monomer Change and Atmospheric Plasma Treatment -

수용성 아크릴계 점착제의 제조와 물성 연구 - 기능성 단량체 변화와 대기압 플라즈마 처리영향 -

  • Sim, Dong-Hyun (Department of Chemical Engineering, Dong-A University) ;
  • Seul, Soo-Duk (Department of Chemical Engineering, Dong-A University)
  • 심동현 (동아대학교 공과대학 화학공학과) ;
  • 설수덕 (동아대학교 공과대학 화학공학과)
  • Published : 2009.01.25

Abstract

Water soluble adhesive was polymerized from butyl acrylate (BA), methyl methacrylate (MMA) and one of various functional monomers such as acrylic acid (AA), 2-hydroxylethyl methacrylate (2-HEMA), glycidyl methacrylic acid (GMA) and acrylamide (AAm). The amount of the functional monomers was 1$\sim$5 wt%/monomer. In order to improve the adhesive power, a substrate was treated using atmospheric flat plasma method. The adhesive power was improved by the addition of the functional monomers with an order of AA> 2-HEMA> GMA> AAm. The holding power of the adhesives, which is related with the thermal properties of the adhesives, increased with the amount of the functional monomers. The effectiveness in improving the holding power has an order of AA > AAm > GMA > 2-HEMA. By treating a substrate with atmospheric flat plasma method, the adhesives containing each of AA, 2-HEMA, GMA and AAm showed the increases of the final adhesion strength by 9.1, 9.4, 9.4, and 1.8%, respectively. In conclusion, the mechanical properties such as adhesive power and holding power could be controlled by introducing.

BA와 MMA 그리고 1$\sim$5 wt%/monomer의 다양한 관능성 단량체(AA, 2-HEMA, GMA, AAm)를 사용하여 수용성 아크릴계 점착제를 중합하였다. 점착박리강도를 향상시키기 위해 대기압 평판형 플라즈마 전처리 방식을 피착제에 사용하였다. 관능성 단량체 종류에 따라 AA>2-HEMA>GMA>AAm의 순으로 높은 점착박리강도를 나타내었다. 유지력은 관능성 단량체의 함량이 증가함에 따라 열적 성질이 증가하여 전체적으로 AA>AAm>GMA>2-HEMA순으로 우수한 유지력을 나타내었다. 피착면에 평판형 플라즈마 전처리 방식을 적용한 결과 AA 9.1%, 2-HEMA 9.4%, GMA 9.4%, AAm 1.8%의 후기점착박리강도 증가를 확인할 수 있었다. 결론적으로, 다양한 관능성 단량체와 플라즈마 표면 처리법을 사용하여 점착박리강도, 유지력과 같은 기계적 물성을 조절할 수 있었다.

Keywords

References

  1. A. J. Kinloch, 'Adhesion and Adhesives', Science and Technology (1986)
  2. P. Tordjeman and E. Papon, J. Appl. Polym. Sci., 38, 1201 (2000) https://doi.org/10.1002/(SICI)1099-0488(20000501)38:9<1201::AID-POLB12>3.0.CO;2-#
  3. W. W. Mooncai, Adhesives Age, 31, 33(1998)
  4. F. T. Sanderson, Adhesives Age, 26, 26(1983)
  5. E. B. William, Adhesives Age, 28, 28(1985)
  6. Istvan Benedek, Pressure-Sensitive Adhesives and Applications, 2nd Edition, Marcel Dekker, New York, 2004
  7. A. J. Backhouse, U. S. Patent 4, 403, 003 (1983)
  8. T. R. Paxton, J. Polym. Sci., 46, 1387 (1992)
  9. D. H. Kaelble and K. C. Uy, J. Adhes., 2, 50 (1970) https://doi.org/10.1080/0021846708544579
  10. K Y. Bing and Y. I. Park, Polymer Science and Technology. 6, 585 (1995)
  11. D. Satas, Handbook of Pressure Sensitive Adhesive Tech- nology, 2nd edition, Van Nostrand Reinhold, New York, 1989
  12. E.W. Ulich, U.S Patent 2,884.126 (1955)
  13. J. I. Amalvy, J. Appl. Polym. Sci., 59, 339(1996) https://doi.org/10.1002/(SICI)1097-4628(19960110)59:2<339::AID-APP18>3.0.CO;2-R
  14. O. Ben-Zion and A. Nussinovitch, J. Adhes. Sci. Technol., 16, 599 (2002) https://doi.org/10.1163/156856102760070394
  15. D. H. Sim and S. D. Seul, Polymer(Korea), 32, 276 (2008)
  16. Robert. L. Cleland and Walter H. Stockmayer, Polymer Science, 17, 473 (1955) https://doi.org/10.1002/pol.1955.120178602
  17. J. Asahara and N. Hori, J. Appl. Polym. Sci., 87, 1493 (2003) https://doi.org/10.1002/app.11529
  18. A. Pizzi and K. L. Mittal, Adhesive Technology and Application, Marcel Dekker, New York, 2003
  19. K. Tanaka, T. Inomata, and M. Kongoma, Thin Solid Films, 386, 217 (2001) https://doi.org/10.1016/S0040-6090(00)01653-9
  20. J. M. Grace, and L. J. Gerenser, J. Disper. Sci. Technol., 24, 305 (2003) https://doi.org/10.1081/DIS-120021793
  21. M. R. Werthimer and R. Bartnikas, Plasma Processing of Polymers, 14, 435 (1997)
  22. C. W. Joo, Y. Y. Choi, J. K. Suh, and E. J. Son, J. Korean Fiber Soc., 28, 473 (1991)
  23. D. H. Sim, S. D. Seul, and S. T. Oh, J. Adhesion and Interface, 8, 1 (2007)
  24. D. H. Sim and S. D. Seul, J. Adhesion and Interface, 8, 23 (2007)