Journal of Welding and Joining

  • 제29권1호
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  • Pages.41-45
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  • 2011
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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인장시험을 통한 Sn-xAg-0.5Cu 무연 솔더의 기계적 물성평가

Estimation of Mechanical Properties of Sn-xAg-0.5Cu Lead-free Solder by Tensile Test

  • 정종설 (서울과학기술대학교 NID 융합기술대학원) ;
  • 신기훈 (서울과학기술대학교 기계공학과) ;
  • 김종형 (서울과학기술대학교 기계설계자동화공학부)
  • Jeong, Jong-Seol (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) ;
  • Shin, Ki-Hoon (Dept. of Mechanical Engineering, Seoul National University of Science and Technology) ;
  • Kim, Jong-Hyeong (School of Mechanical Design and Automation Engineering, Seoul National University of Science and Technology)
  • 투고 : 2010.10.28
  • 심사 : 2010.12.13
  • 발행 : 2011.02.28
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초록

SnAgCu lead-free solder alloy is considered as the best alternative to eutectic tin-lead solder. However, the detailed material properties of SnAgCu solder are not available in public. Hence, this paper presents an estimation of mechanical properties of SnAgCu lead-free solder. In particular, the weight percent of Ag was varied as 1.0wt%, 2.5wt%, 3.0wt%, and 4.5wt% in order to estimate the effect of Ag in the Sn-xAg-0.5Cu ternary alloy system. For this purpose, four types of SnAgCu bars were first molded by casting and then standard specimens were cut out of molded bars. Micro-Vickers hardness, tensile tests were finally performed to estimate the variations in mechanical properties according to the weight percent of Ag. Test results reveal that the higher the weight percent of Ag is, the higher the hardness, yield strength, and ultimate tensile strength become. More material properties will be further investigated in the future work.

키워드

참고문헌

  1. A. Shed : Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joint, Proceedings of 54th ECTC (2004), Las Vegas, Nevada, USA, 737-746
  2. J. S. Jeong, Y. S. Lee, K. H. Shin, S. K. Cheong, J. H. Kim and D. Y. Jang : An Experimental Study on the Failure Characteristics of Sn-xAg-Cu Lead Free Solder, Journal of the KSMTE (2009), 18-5, 449- 454 (in Korean)
  3. Y. S. Lee, J. S. Jeong, H. S. Kim and K. H. Shin, : An Experimental Study on the Failure Characteristics of Flip Chips in Cylic Bending Test, Journal of the KSMTE (2009), 18-4, 362-368 (in Korean)
  4. F. X. Che, E. C. Poh. W.H. Zhu, B. S. Xiong : Ag Content Effect on Mechanical Properties of Sn-xAg- 0.5Cu Solders, Proceedings of 9th ECTC (2007), 713-718
  5. K. H. Shin, H. T. Kim, and D. Y. Jang : An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages, Journal of the KSMTE (2007), 16-5, 134-139 (in Korean)
  6. J. W. Nah, J. H. Kim, H. M. Lee and K. W. Paik : Electromigraion in flip chip solder bump of 97PB- 3Sn/37Pb-63Sn combination structure, Acta Materialia (2004), 52, 129-136 https://doi.org/10.1016/j.actamat.2003.08.035
  7. X. Li and Z. Wang : Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies, Journal of Materials Processing Technology (2007), 183-1, 6-12 https://doi.org/10.1016/j.jmatprotec.2006.09.010
  8. ASTM E 8M-04, Standard Test Methods for Tension Testing of Metallic Materials [Metric] (2004)

피인용 문헌

  1. Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame vol.31, pp.5, 2013, https://doi.org/10.5781/KWJS.2013.31.5.77