Journal of Welding and Joining

  • 제29권3호
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  • Pages.19-26
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  • 2011
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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삼차원적층형 집적회로 구현을 위한 자기조직화정합기술을 이용한 고속.고정밀 접합기술

High Speep/High-Precision Chip Joining Using Self-Assembly Technology for Three-Dimensional Integrated Circuits

  • 발행 : 2011.06.30
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⟨ 이전 논문 다음 논문 ⟩

초록

본 논문에서는 액체의 표면장력을 이용하여 복수의 KGD 들을 웨이퍼 상태에서 일괄접합함으로써, 높은 수율의 삼차원적층칩을 빠른 생산성으로 제작할 수 있는, 고속 고정밀 접합기술인 자기조직화정합 (Selfassembly) 기술에 대해 소개를 하였다. 본 연구실에서 개발한 self-assembly 기술을 적용하여 5mm 각(角) 크기의 칩 500개를 1초 이내에 평균 $0.5{\mu}m$ 정도의 높은 정밀도로 8인치 웨이퍼상에 일괄접합시키는데 성공하였다. Self-assembly 기술에 의한 삼차원 칩 적층방식은, 기존의 pick-and-place 적층방식에서 높은 정밀도의 접합특성을 확보하는데 필요한 공정시간을 혁신적으로 단축하는 것이 가능하고, 웨이퍼 레벨에서 복수의 KGD 들을 일괄접합하는 것이 가능하므로, 향후 TSV 기술의 양산화를 실현하는데 적합한 고속 고정밀 접합 기술로서 기대가 크다. 현재 본 연구실에서는 두께가 $50{\mu}m$ 이하의 얇은 LSI 칩 및 메탈범프가 형성된 LSI 칩 등을 이용하여, self-assembly 기술에 의한 삼차원 적층형 집적회로 구현을 위한 접합기술을 개발 중에 있다.

키워드

참고문헌

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