The Journal of the Korea institute of electronic communication sciences (한국전자통신학회논문지)

Korea Institute of Electronic Communication Science (한국전자통신학회)
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Electrical Characteristic of PMMA Thin Film by Plasma Polymerization Method with Process Pressure and RF Substrate Bias Power

공정압력 및 기판바이어스 인가유무에 따른 PMMA 플라즈마중합박막의 전기적 특성

  • Received : 2011.08.24
  • Accepted : 2011.10.12
  • Published : 2011.10.31
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Abstract

In this paper, We have fabricated PMMA thin films by plasma polymerization method for organic thin film transistor's insulator layer. In the electrical characteristic results with deposition pressures and substrate RF bias power in thin film deposition process, we have got dielectric constant of 3.4, high deposition rate of 8.6 [nm/min] and high insulation characteristics in condition of RF100 [W], Ar20 [sccm], 5 [mtorr], RF bias 20 [W]. Therefore, the fabricated thin films are possible as insulation layer of OTFT and organic memory.

본 논문에서는 유기박막트랜지스터용 절연막에 활용코자 플라즈마중합방법을 이용하여 PMMA 절연막을 제작하였다. 기판의 바이어스인가 및 증착중 압력변화에 따른 전기적특성을 파악한 결과, 플라즈마중합법에 의한 MMA절연막의 증착조건 RF100[W], Ar20[sccm], 5[mtorr], RF bias 20[W] 에서 3.4의 유전율, 8.6[nm/min]의 높은 증착율 및 높은 절연특성을 얻을수 있다. 이처럼 얻어진 플라즈마 중합막은 유기트랜지스터 및 유기메모리의 절연막으로 충분히 활용가능함을 알 수 있다.

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References

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