Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders

Sn3.5Ag와 Sn0.7Cu 무연솔더에 대한 고온 진동 신뢰성 연구

  • Ko, Yong-Ho (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology) ;
  • Kim, Taek-Soo (Dept. of Mechanical Engineering, KAIST) ;
  • Lee, Young-Kyu (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology) ;
  • Yoo, Sehoo (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology) ;
  • Lee, Chang-Woo (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology)
  • 고용호 (한국생산기술연구원 용접접합기술센터) ;
  • 김택수 (한국과학기술원 기계공학과) ;
  • 이영규 (한국생산기술연구원 용접접합기술센터) ;
  • 유세훈 (한국생산기술연구원 용접접합기술센터) ;
  • 이창우 (한국생산기술연구원 용접접합기술센터)
  • Received : 2012.03.12
  • Accepted : 2012.07.13
  • Published : 2012.09.30
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Abstract

In this study, the complex vibration reliability of Sn-3.5Ag and Sn-0.7Cu having a high melting temperature was investigated. For manufacturing of BGA test samples, Sn-3.5Ag and Sn-0.7Cu balls were joined on BGA chips finished by ENIG and the chips were mounted on PCB finished OSP by using reflow process. For measuring of resistance change during complex vibration test, daisy chain was formed in the test board. From the results of resistance change and shear strength change, the reliability of two solder balls was compared and evaluated. During complex vibration for 120 hours, Sn-0.7Cu solder was more stable than Sn-3.5Ag solder in complex vibration test.

본 연구에서는 고 융점을 지니는 Sn-3.5Ag, Sn-0.7Cu 솔더의 복합 진동 신뢰성을 고찰하였다. 테스트 샘플은 ENIG (Electroless Nikel Immersion Gold) 표면처리 된 BGA (Ball Grid Array)칩에 Sn-3.5Ag, Sn-0.7Cu 솔더볼을 접합 후, 솔더볼이 장착된 BGA부품을 OSP (Organic Solderability Preservative) 표면처리 된 PCB에 리플로우 공정을 통하여 실장 하였다. 복합 진동 신뢰성 시험 중에 부품의 저항 변화를 측정하기 위하여 BGA칩과 PCB는 데이지 체인을 구성하여 제작하였다. 이를 통한 저항의 변화와 시험 전후의 부품에 대한 전단 강도 시험을 통하여 두 종류의 솔더에 대한 복합환경에서의 신뢰성을 비교, 평가하였다. 120시간 복합 진동 동안 전기저항 증가와 접합강도 저하를 고려할 때 Sn-0.7Cu 솔더가 복합 환경에서 높은 안정성을 나타내었다.

Keywords

References

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