Transactions of Materials Processing (소성∙가공)

The Korean Society for Technology of Plasticity and materials processing (한국소성∙가공학회)
권호 표지
DOI QR코드

DOI QR Code

A multi Step Cure Process to Prevent Residual Bubbles in LED Encapsulation Silicone Resin

LED Encapsulation 실리콘의 기포잔류방지를 위한 Step 경화공정 연구

  • 송민재 (한국생산기술연구원 금형.성형연구그룹, 고려대학교 대학원) ;
  • 김흥규 (한국생산기술연구원 금형.성형연구그룹) ;
  • 윤길상 (한국생산기술연구원 금형.성형연구그룹) ;
  • 김권희 (고려대학교 기계공학부)
  • Received : 2011.11.25
  • Accepted : 2012.01.06
  • Published : 2012.04.01
Download PDF
⟨ Previous Next ⟩

Abstract

Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.

Keywords

References

  1. J. Zhang, Y. C. Xu, P Huang, 2009, Effect of cure cycle on curing process and hardness for epoxy resin, Express Polym. Lett., Vol. 3, No. 9, pp. 534-541. https://doi.org/10.3144/expresspolymlett.2009.67
  2. S. R. White, H. T. Hahn, 1992, Process modeling of composites materials: Residual stress development during cure, Part I. Model formulation, J. Compos. Mater., Vol. 26, No. 16, pp. 2402-2422. https://doi.org/10.1177/002199839202601604
  3. P. R. Ciriscioli, Q. Wang, G. S. Springer, 1992, Autoclave curing-Comparisons of model and test results, J. Compos. Mater., Vol. 26, No. 1, pp. 90-102. https://doi.org/10.1177/002199839202600106
  4. S. R. White, Y. K. Kim, 1996, Staged curing of composite materials, Composites Part A, Vol. 27, No. 3, pp. 219-227. https://doi.org/10.1016/1359-835X(95)00023-U
  5. L. Liu, B. M. Zhang, D. Fu, 2006, Effects of cure cycles on void content and mechanical properties of composite laminates, Compos. Struct., Vol. 73, No. 3, pp. 303-309. https://doi.org/10.1016/j.compstruct.2005.02.001
  6. Sh. Teplinsky, E. M. Gutman, 1996, Computer simulation of process induced stress and strain development during cure of thick-section thermosetting composites, Comput. Mater. Sci., Vol. 6, No. 1, pp. 71-76. https://doi.org/10.1016/0927-0256(96)00035-3
  7. A. C. Loos, G. S. Springer, 1983, Curing of epoxy matrix composites, J. Compos. Mater., Vol. 17, pp.135-169. https://doi.org/10.1177/002199838301700204
  8. M. R. Kamal, S. Sourour, 1973, Kinetics and thermal characterization of thermoset cure, Polym. Eng. Sci., Vol.13, No.1, pp. 59-64. https://doi.org/10.1002/pen.760130110

Cited by

  1. An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant vol.7, pp.6, 2014, https://doi.org/10.3390/ma7064088