Journal of Information Display

The Korean Infomation Display Society (한국정보디스플레이학회)
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Effects of some factors on the thermal-dissipation characteristics of high-power LED packages

  • Ji, Peng Fei (Green Display Device Lab, Department of Display Engineering, Hoseo University) ;
  • Moon, Cheol-Hee (Green Display Device Lab, Department of Display Engineering, Hoseo University)
  • Received : 2011.07.20
  • Accepted : 2011.09.27
  • Published : 2012.03.30
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Abstract

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

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