DOI QR코드

DOI QR Code

Deformation Analysis of a Metal Mask for the Screen Printing of Micro Bumps

스크린 인쇄용 미세 범프 금속마스크의 변형특성 해석

  • 이기연 (서울과학기술대학교 NID융합기술대학원) ;
  • 이혜진 (한국생산기술연구원 미래융합연구그룹) ;
  • 김종봉 (서울과학기술대학교 기계자동차공학과) ;
  • 박근 (서울과학기술대학교 기계시스템디자인공학과)
  • Received : 2012.05.22
  • Accepted : 2012.06.13
  • Published : 2012.06.15

Abstract

Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.

Keywords

References

  1. Crawford, G. P., 2005, Flexible flat panel display, John Wiley & Sons, New York.
  2. Pardo, D. A., Jabbour, G. E., and Peyghambarian, N., 2000, "Application of Screen Printing in the Fabrication of Organic Light-emitting Devices," J. Adv. Mater., Vol. 12, No. 17, pp. 1249-1252. https://doi.org/10.1002/1521-4095(200009)12:17<1249::AID-ADMA1249>3.0.CO;2-Y
  3. Krebs, F. C., Fyenbo, J., and Jorgensen, M., 2010, "Product Integration of Compact Roll-to-roll Processed Polymer Solar Cell Modules: Methods and Manufacture using Flexographic Printing," J. Mater. Chem., Vol. 20, No. 41, pp. 8994-9001. https://doi.org/10.1039/c0jm01178a
  4. Lee, J., Cho, S., Lee, Y., Kim, K., Cheon, C., and Jung, J., 2005, "Aging Characteristics of Sn-1.8 Bi 0.7-Cu0.6 in Solder," J. Microelecton Packag. Soc., Vol. 12, No. 4, pp. 301-306.
  5. Ko, Y. K., Shin, Y. S., Yoo, S., and Lee, C. W., 2009, "Via Filling Technique with Molten Solder and Low Temperature Solder Bump for 3D Packaging," Proc. 2009 Fall Conf. Kor. Soc. Prec. Engng., pp. 699-700.
  6. Seo, W. S., Min, B. W., Park, K., Lee, H. J., and Kim, J. B., 2012, "Improvement of Filling Characteristics of Micro-bumps in the Stencil Printing Process," Jour. of KSMTE, Vol. 21, No. 1, pp. 26-32.
  7. Kim, M., Ahn, B., and Jung, J., 2001, "A study on Melting Phenomena of Solder Paste," J. Microelecton Packag. Soc., Vol. 8, No. 1, p. 5-11.
  8. Evans, J. W., and Beddow, J. K., 1987, "Characterization of Particle Morphology and Rheological Behavior in Solder Paste," IEEE Trans. Compon., Hybrids, Manuf. Technol., Vol. 10, No. 2, pp. 224-231. https://doi.org/10.1109/TCHMT.1987.1134725
  9. Loomanm, D., 2007, "Submodeling in ANSYS Workbench," ANSYS Advantage, Vol. 1, No. 2, pp. 34-36.