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Investigation of Dispersion Stability of Conductive Nano Ink Using 1-Octanethiol Coated Copper Nano Powders

1-Octanethiol이 코팅된 나노 구리 분말을 이용한 나노 잉크의 분산도에 대한 연구

  • Received : 2012.07.30
  • Accepted : 2012.09.27
  • Published : 2012.09.30

Abstract

Copper nano particles have been considered as the materials for conductive ink due to its good thermal, electrical conductivity and low cost. However, copper nanoparticles oxidize easily, decreasing dispersion stability and electrical conductivity. Therefore, it is important to develop a method to minimize oxidation of copper nano particles to improve its dispersion stability property in copper nano ink. In this study, copper nano particles were coated with 1-Octanethiol VSAM(Vaporized Self Assembled Multilayers) to prevent oxidation and coated copper powders were dispersed in conductive ink successfully by studying its relationship of different chain length of solvents to 1-Octanethiol coating layer to fabricate nano ink. Various alcohol solvents, such as 1-Hexanol, 1-Octanol, and 1-Decanol were used. The coating layer was observed using FESEM and TEM. Furthermore, dispersion of copper nano particles in nano inks, was characterized using Turbiscan analyzer, viscometer, and contact angle measurement tool.

Keywords

References

  1. B. K. Park, D. Kim, S. Jeong, J. Moon, and J. S. Kim, "Direct Writing of Copper Conductive Patterns by Ink-jet Printing," J. Thin Solid Films., 515 7706-11(2007). https://doi.org/10.1016/j.tsf.2006.11.142
  2. T. Ito and S. Okazaki, "Pushing the Limits of Lityography," Nature., 406 1027-31 (2000). https://doi.org/10.1038/35023233
  3. K. salaita, Y. Wang, and C. A. Mirikin, "Applications of Dippen Nanolithography," Nat. Nanotechnol., 2 145-55 (2007). https://doi.org/10.1038/nnano.2007.39
  4. T. Kawase, S. Moriya, C. J. Newsome, and T. Shimoda, "INkjet Printing of Polymeric Field-dffect Transistor and Its Application", JSAP, 44 3649-58 (2005).
  5. J. Bharathan and Y. Yang, "Polymer Electroluminescent Devices Processed by Inkjet Printing," Appl. Phys. Lett., 72 2660-62 (1998). https://doi.org/10.1063/1.121090
  6. I. K. You, J. B. Koo, Y. Y. Noh, and B. G. Yu, "Technology Trend of Printed Electronics(in Korean)," ETRI, 24 [6] 41- 51 (2009).
  7. Y. S. Kim, S. K. Kim, and J. J. Kim, "Room Temperature Surface Passivation Method using thin Ag Layer at the Damascene Cu Structure," Theories and Applications of Chemical Engineering, 8 5210-13 (2002).
  8. Y. Wang, P. Chen, and M. Liu, "Synthesis of Well-defined Copper Nanocubes by a One-pot Solution Process," Nat. Nanotechnol., 17 6000-6 (2006). https://doi.org/10.1088/0957-4484/17/24/016
  9. G. K. Jennings, J. C. Munro, T. H. Yong, and P. E. Laibinis, "Effect of Chain Length on the Protection of Copper by Nalkanethiols," Langmuir., 14 6130-39 (1998). https://doi.org/10.1021/la980333y
  10. M. R. Seong, G. Y. Lee, D. K. Kim, Y. S. Kim, and C. S. Lee, "Octanethiol Coating of Nano-sized Copper Powders using the Vapor Self-assembled Monolayer Method," Met. Mater. Int., 15 963-66 (2009). https://doi.org/10.1007/s12540-009-0963-1
  11. M. H. Schoenisch and J. E. Pemberton, "Air Stability of Alkanethiol Self-assembled Monolayers on Silver and Gold Surfaces," J. Am. Chem. Soc., 120 4502-13 (1998). https://doi.org/10.1021/ja974301t
  12. C. S. Lee, Y. B. Choi, M. R. Seong, G. Y. Lee, and J. Y. Choi, Korean Patent, 10-2008-0060198 (2008).
  13. J. H. Kwon, S. Y. Park, Y. S. Kim, and C. S. Lee, "Controlled Thicknesses of Vaporized Self-Assembled Multilayers on Copper Nanopowders Under Ultra-High Vacuum (UHV)," Nat. Nanotechnol., 12 [2] 1206-10 (2012).
  14. Quactachrome, Particle World 4, pp. 8 ed. by Dietmar Klank, Ton Goverde, 2010.

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