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목조건축물 구조부재의 열전도율에 따른 건물외피의 단열 성능

Thermal Performance of Wooden Building Envelope by Thermal Conductivity of Structural Members

  • 김석환 (숭실대학교 건축학부 건축환경재료연구실) ;
  • 유슬기 (숭실대학교 건축학부 건축환경재료연구실) ;
  • 서정기 (숭실대학교 건축학부 건축환경재료연구실) ;
  • 김수민 (숭실대학교 건축학부 건축환경재료연구실)
  • Kim, Sughwan (Building Environment and Materials Lab, School of Architecture, Soongsil University) ;
  • Yu, Seulgi (Building Environment and Materials Lab, School of Architecture, Soongsil University) ;
  • Seo, Jungki (Building Environment and Materials Lab, School of Architecture, Soongsil University) ;
  • Kim, Sumin (Building Environment and Materials Lab, School of Architecture, Soongsil University)
  • 투고 : 2013.05.03
  • 심사 : 2013.11.28
  • 발행 : 2013.11.25

초록

국내에서 주로 사용되고 있는 건물에너지 성능평가 시뮬레이션 마다 상이한 재료의 열전도율로 평가 되고 있음이 파악되었다. 시뮬레이션을 통한 정확한 건물에너지부하를 평가하기 위하여, 각 시뮬레이션에서 목조건축물의 스터드로 사용되고 있는 목재의 열전도율을 확인하고, 이에 따른 벽체의 열관류율과 부재 접합부위에서의 선형열교 차이를 연구하였다. 각 시뮬레이션은 동일 수종에 대해 상이한 열전도율을 채택 후, 각 시뮬레이션에서 추출한 열전도율 간의 차이가 가장 상이한 소나무의 열전도율을 스터드에 적용하였다. 시뮬레이션 간 지붕, 벽체, 지면 슬래브의 열관류율 중 최대오차는 $0.023W/m^2{\cdot}K$이었으며, 지붕의 서까래 접합부, 지붕-벽체 접합부, 지면슬래브-벽체 접합부 중 최대 선형열교 오차는 $0.025W/m{\cdot}K$이었다. 또한, HEAT2 정상상태전열해석 프로그램을 활용하여 선형열교 및 벽체의 온도변화에 대한 전열해석 이미지를 분석하였다. 구조체에 온도 분포를 선으로 표시하여 단열이 부족한 곳에서는 온도선이 급격하게 변하는 것이 확인되었고, 온도선이 급격하게 변하는 부위에서는 다른 곳보다 온도가 낮으며, 다른 구조체 부분보다 더 많은 열류가 손실됨이 확인되었다.

Building energy simulations which are mainly used in Korea have evaluated the building energy performance with the different thermal conductivity of construction materials. In order to evaluate the energy consumption accurately, the difference in thermal conductivity of the wood used in stud for wooden structure was confirmed from the each simulation. In addition, the thermal transmission of building members and the thermal bridge at the conjunction of building members according to thermal conductivity from each simulation programs were researched. The thermal conductivity of pine that has the largest variation among the energy simulations was applied to the thermal properties of studs in wooden structure. The maximum error between the maximum and minimum thermal transmission of roof, wall, and floor slab was $0.023W/m^2{\cdot}K$. Plus, that thermal bridge at Rafter junction on the roof, roof-wall joint, and floor slab-wall joint was $0.025W/m{\cdot}K$. The heat transfer image for changes in temperature and the heat exchange were analyzed by HEAT2 program. The distorted temperature lines were found around the insufficient insulated connection parts. It was predicted that the temperature at the distorted parts in the analyzed image was lower than that of the other portion of the other structures.

키워드

참고문헌

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피인용 문헌

  1. Evaluation of The Hygrothermal Performance by Wall Layer Component of Wooden Houses Using WUFI Simulation Program vol.44, pp.1, 2016, https://doi.org/10.5658/WOOD.2016.44.1.75
  2. Analysis of Hygrothermal Performance of Wood Frame Walls according to Position of Insulation and Climate Conditions vol.44, pp.2, 2016, https://doi.org/10.5658/WOOD.2016.44.2.264
  3. Evaluation and Analysis of The Building Energy Saving Performance by Component of Wood Products Using EnergyPlus vol.44, pp.5, 2016, https://doi.org/10.5658/WOOD.2016.44.5.655
  4. Analysis of Hygrothermal Performance for Standard Wood-frame Structures in Korea vol.44, pp.3, 2016, https://doi.org/10.5658/WOOD.2016.44.3.440