DOI QR코드

DOI QR Code

AC Insulation Breakdown Properties of the EMNC to Application of Distribution Molded Transformer

배전용 몰드변압기 적용을 위한 EMNC의 교류절연파괴특성 연구

  • Park, Jae-Jun (Dept. of Electrical Electronic Engineering, Joongbu University)
  • 박재준 (중부대학교 전기전자공학과)
  • Received : 2013.04.06
  • Accepted : 2013.04.28
  • Published : 2013.05.01

Abstract

A conventional epoxy-microsilica composite (EMC) and an epoxy-microsilica-nanosilicate composite (EMNC) were prepared in order to apply them to mold-type transformers, current transformers (CT) and potential transformers (PT). Nanosilicate was exfoliated in a epoxy resin using our electric field dispersion process and AC insulation breakdown strength at $30{\sim}150^{\circ}C$, glass transition temperature and viscoelasticity were studied. AC insulation breakdown strength of EMNC was higher than that of EMC and that value of EMNC was far higher at high temperature. Glass transition temperature and viscoelasticity property of EMNC was higher than those of EMC at high temperature. These results was due to the even dispersion of nanosilicates among the nanosilicas, which could be observed using transmission electron microscopy (TEM). That is, the nanosilicates interrupt the electron transfer and restrict the mobility of the epoxy chains.

Keywords

References

  1. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, S. Kuge, M. Kozako, and T. Tanaka,"Approach by Nano-and Micro-filler Mixture toward Epoxy-based Nanocomposites as Industrial Insulating Materials", IEEJ Trans. Fund. Mater. Vol. 126, No. 11, pp. 1136-1143. 2006. https://doi.org/10.1541/ieejfms.126.1136
  2. Y. S. Cho, H. K. Lee, M. J. Shim, and S. W. Kim, "Characteristics of polymer insulator materials : Voltage-lifetime characteristics of DGEBA/MDA/SN system", Materials Chemistry and Physics Vol. 66, pp. 70-76, 2000 https://doi.org/10.1016/S0254-0584(00)00272-8
  3. R. Sarathi, R. K. Sahu, and P. Rajeshkumar, "Understanding the thermal, mechanical and electrical properties of epoxy nanocomposites", Materials Science and Engineering A 445-446, pp. 567-578, 2007 https://doi.org/10.1016/j.msea.2006.09.077
  4. N. Hayakawa, H. Maeda, S. Chigusa, and H. Okubo, "Partial discharge inception characteristics of $LN_2$/epoxy composite insulation system under thermal bubble condition", Cryogenics, Vol. 40, pp. 167-171,2000. https://doi.org/10.1016/S0011-2275(00)00024-2
  5. T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kozako, and T. Tanaka, "Effects of Nano-and Micro-filler Mixture on Electrical Insulation Properties of Epoxy Based Composites", IEEE Transactions on Dielectrics and Electrical Insulation Vol. 13, No. 1; February 2006
  6. P. L. Teh, M. Mariatti, H. M. Akil, C. K. Yeoh, K. N. Seetharamu, A. N. R. Wagiman, and K. S. Beh, Mater. Lett. 61, 2156 (2007). https://doi.org/10.1016/j.matlet.2006.08.036
  7. Sungtack Kang, Sung Il Hong, Chul Rim Choe, Min Park, Soonho Rim, Junkyung Kim, "Preparation and characterization of epoxy composites filled with functionalized nanosilica particles obtained via sol-gel process", Polymer, Vol. 42, pp.879-887, 2001 https://doi.org/10.1016/S0032-3861(00)00392-X
  8. Y. Nakamura, M. Yamaguchi, M. Okubo, and T. Matsumoto, Journal of Applied Polymer Science. Vol. 45, pp. 1281, 1992. https://doi.org/10.1002/app.1992.070450716
  9. Silvia Barus, Marco Zanetti, Massimo Lazzari, Luigi Costa, "Preparation of polymeric hybrid nanocomposites based on PE and nanosilica", Polymer, Vol. 50, pp. 2595-2600, 2009. https://doi.org/10.1016/j.polymer.2009.04.012
  10. S. C. Kwon and T. Adachi, Journal of Materials Science. Vol. 42, pp. 5516 ,2007. https://doi.org/10.1007/s10853-006-1025-4
  11. Y. L. Liang, R. A. Pearson, "Toughening mechanisms in epoxy-silica nanocomposites (ESNs)", Polymer, Vol. 50, pp. 4895-4905, 2009. https://doi.org/10.1016/j.polymer.2009.08.014
  12. C. Xenopoulos, L. Mascia, and S. J. Shaw, Journal of Materials Chemistry, Vol. 12, pp. 213 ,2002. https://doi.org/10.1039/b105434c
  13. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako, and T. Tanaka, "Influence of Temperature on Mechanical and Insulation Properties of Epoxy-Layered Silicate Nanocomposite",IEEE Transactions on Dielectrics and Electrical Insulation Vol. 13, No. 1; February 2006.
  14. Jae-Jun Park and Jae-Young Lee, "A New Dispersion Method for the Preparation of Polymer/Organoclay Nanocomposite in the Electric Fields", IEEE Transactions on Dielectrics and Electrical Insulation Vol. 17, No. 5; pp. 1516-1522 October 2010 https://doi.org/10.1109/TDEI.2010.5595553
  15. Jae-Jun Park, Chang-Hoon Lee, Jae-Young Lee and Hee-Dong Kim, "Preparation of Epoxy/Micro- and Nano- Composites by Electric Field Dispersion Process and Its Mechanical and Electrical Properties", IEEE Transactions on Dielectrics and Electrical Insulation Vol. 18, No. 3; pp. 667-674, June 2011 https://doi.org/10.1109/TDEI.2011.5931051
  16. Li-Yu Lin, Joong-Hee Lee, Chang-Eui Hong, Gye-Hyoung Yoo, Suresh G. Advani, "Preparation and characterization of layered silicate/glass fiber/epoxy hybrid nanocomposites via vacuum-assisted resin transfer molding (VARTM)", Composites Science and Technology(66), pp. 2116-2125, 2006 https://doi.org/10.1016/j.compscitech.2005.12.025