한국음향학회지 (The Journal of the Acoustical Society of Korea)

  • 제32권6호
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  • Pages.502-508
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  • 2013
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  • 1225-4428(pISSN)
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  • 2287-3775(eISSN)
한국음향학회 (The Acoustical Society of Korea)
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전도성 후면층을 이용한 2D 배열 초음파 트랜스듀서의 설계 및 제작

Design and Fabrication of 2D Array Ultrasonic Transducers with a Conductive Backer

  • 투고 : 2013.07.09
  • 심사 : 2013.08.29
  • 발행 : 2013.11.30
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⟨ 이전 논문 다음 논문 ⟩

초록

본 논문에서는 1-3 복합체 형태의 전도성 후면층을 이용한 2D 배열 초음파 트랜스듀서를 설계 및 제작하고 그 특성을 평가하였다. 1-3 복합체 형태의 전도성 후면층은 일반적인 재료를 사용해 널리 쓰이는 1-3 복합체 공정을 통하여 제작되었다. 본 연구의 대상이 되는 2D 배열 트랜스듀서는 4,096개의 구동 소자로 이루어져 있고, 각 소자의 중심주파수 및 비대역폭은 각각 3.5 MHz 및 60 % 이상을 목표로 설계하였다. 제작된 트랜스듀서는 중심주파수 및 비대역폭 목표치를 만족하였으며, 전체 구동 소자간의 특성도 0.81 dB 이내로 균일하였다. 따라서 본 연구에서 제시한 전도성 후면층의 2D 배열 초음파 트랜스듀서에 대한 적용 가능성이 검증되었다.

In this paper, 2D array transducers using a conductive backer similar to 1-3 composites have been designed, fabricated, and evaluated. The conductive backer was based on well known manufacturing process of 1-3 composites with affordable ingredients. The 2D array transducer had 4,096 elements designed to have 3.5 MHz center frequency and a fractional bandwidth over 60 %. Fabricated prototype of the transducer satisfied the specifications in the center frequency and bandwidth. Performance over the entire elements was so uniform that the standard deviation was less than 0.81 dB. Thus applicability of the conductive backer proposed in this work to 2D array transducers was verified.

키워드

참고문헌

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