The Journal of the Korea institute of electronic communication sciences (한국전자통신학회논문지)

Korea Institute of Electronic Communication Science (한국전자통신학회)
권호 표지
DOI QR코드

DOI QR Code

A Study on the Thermal Characteristics of COB LED using Thermoelectric Element

열전소자를 이용한 COB LED의 열적 특성 분석에 관한 연구

  • 김효준 (원광대학교 정보통신공학과) ;
  • 김태형 (전북대학교 IT 응용시스템공학과) ;
  • 김용갑 (원광대학교 정보통신공학과) ;
  • 황근창 (원광인체과학연구소)
  • Received : 2014.11.03
  • Accepted : 2014.12.15
  • Published : 2014.12.31
Download PDF
⟨ Previous Next ⟩

Abstract

This paper was designed to analyze thermal properties using thermoelectric element for air-cooling heat dissipation of 13.2W-class COB LED. For comparative analysis with generally used air cooling methods, the heat sink was designed and produced, and this experiment was conducted to measure the temperature distribution using a contact thermometer while the COB LED was operating for 100 minutes. One result was about $75^{\circ}C$ for the general cooling method, and the other was $57^{\circ}C$ while the thermoelectric element was operating with applying the current of 0.8A to the thermoelectric element. This results confirmed that the method of applying thermoelectric element was much better in the dissipation of thermal condense on the COB LED than that of the general air cooling one. The temperature on the contact points of COB LED using thermoelectric element was decreased about 31% compared with the air cooling method from $75^{\circ}C$ to $57^{\circ}C$.

본 논문에서는 13.2W급 COB LED의 공랭식 방열을 위해 열전소자를 이용하여 열적 특성을 분석하였다. 기존 방식과의 방열 성능을 비교 분석하기 위하여 Heat Sink를 설계 및 제작 하였고 실험은 100분간 COB LED를 구동시켜 접촉식 온도계를 통하여 온도 분포를 측정하였다. 접합부의 온도 측정 결과 열전소자를 사용하지 않는 방식에서는 약 $75^{\circ}C$로 나타났고, 열전소자에 0.8A의 전류를 인가하여 구동하였을 때 $57^{\circ}C$로 열 응집현상이 가장 심한 COB LED 접합부분의 열은 기존의 방식보다 약 31% 감소됨을 확인하였다.

Keywords

References

  1. Y.-T. Cho, "Heat Radiation of Multichip 10W LED Light Using Thermoelectric Module(TEM)," J. of the Korea Society of Manufacturing Technology, vol. 21, no. 1, 2012, pp. 46-50. https://doi.org/10.7735/ksmte.2012.21.1.046
  2. J.-H. Yoo, H.-J. Lee, N.-J. Kim, and S.-H. Kim, "A Design of Thin Film Thermoelectric Cooler for Chip-on-Board(COB) Assembly," The Trans. of the Korean Institute of Electrical Engineers, vol. 51, no. 9, 2010, pp. 1616-1620.
  3. J.-H. Kwon, H.-J. Kim, K.-J. Park, Y.-K. Kim, and G.-C. Hoang, "Themal Characteristics of Designed Heat Sink for 13.5W COB LED Down Light," J. of the Korea Institute of Electronic Communication Sciences, vol. 9, no. 5, 2014, pp. 561-566. https://doi.org/10.13067/JKIECS.201.9.5.561
  4. T.-S. Jang, J.-H. Kwon, Y.-K. Kim, and C.-B. Park, "A LED Light Communication Transceiver Module for Ubiquitous Sensor Networks," J. of the Korea Institute of Electronic Communication Sciences, vol. 7, no. 6, 2012, pp. 1513-1518.
  5. J.-M. Han and D.-S. Seo, "Electro-optical Characteristics of LED Flat Light Source in Low Temperature Condition," The J. of The Institute of Internet, Broadcasting and Communication, vol. 11, no. 1, 2011, pp. 61-66.
  6. M.-G. Jang, M.-S. Jun, T.-M. Roh, and J.-D. Kim, "Thermoelectric Power Generation with High Efficiency," Electronics and Telecommunications Trends, vol. 23, no. 6, 2008, pp. 12-21.
  7. S.-H. Han, Y.-J. Kim, J.-H. Kim, D.-J. Kim, J.-Y. Jung, S.-I. Kim, and G.-S. Cho, "Control of Heat Temperature in Light Emitting Diodes with Thermoelectric Device," J. of the Korean vacuum Society, vol. 20, no. 4, 2011, pp. 280-287. https://doi.org/10.5757/JKVS.2011.20.4.280
  8. Y.-S. Ko, W.-C. Lee, and I.-S. Kim, "A Consideration on the Application of Thermoelectric Cooler to Obesity Therapy," J. of the Korea Institute of Electronic Communication Sciences, vol. 7, no. 6, 2012, pp. 1437-1442.

Cited by

  1. Analysis of Temperature and Humidity Characteristics of Air-Cooled Insect-Rearing Equipment Using Thermoelectric Elements vol.19, pp.1, 2018, https://doi.org/10.1007/s42341-018-0003-2