Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Fabrication for Optical Layer and Packaging Technology of Optical PCB

광 PCB의 광 회로층 제작 및 패키징 기술

  • Kim, Taehoon (Department of Cogno-Mechatronics Engineering, Pusan National University) ;
  • Huh, Seok-Hwan (ACI division, Samsung Electro-Mechanics) ;
  • Jeong, Myung Yung (Department of Cogno-Mechatronics Engineering, Pusan National University)
  • 김태훈 (부산대학교 인지메카트로닉스공학과) ;
  • 허석환 (삼성전기(주)) ;
  • 정명영 (부산대학교 인지메카트로닉스공학과)
  • Received : 2015.03.13
  • Accepted : 2015.03.20
  • Published : 2015.03.30
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Abstract

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

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References

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