Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Study on Electrical and Mechanical Properties of Epoxy Insulation Barrier for High Voltage GIS Using a Filler of SiO2 and Al2O3

SiO2와 Al2O3를 충진재료로 사용하는 초고압 GIS용 에폭시 절연물 베리어의 전기적 및 기계적 특성에 관한 연구

  • Suh, Wang-Byuck (Department of Mechanical Engineering, Yeungnam University) ;
  • Bae, Dong-Ho (Department of Mechanical Engineering, Sungkyunkwan University)
  • Received : 2015.04.26
  • Accepted : 2015.05.24
  • Published : 2015.06.01
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Abstract

Some insulating materials are organized and analyzed with variables to obtain the optimized profile of encapsulated three phase of epoxy barrier which is applied to gas compartment and supporting conductors for high voltage GIS (gas insulated switchgear). The high voltage GIS is used in electrical power system and operating reliability. In this paper, optimization possibility of barrier shape including both electrical insulation performance and mechanical strength, premised on that condition minimizing volume and light weight should be kept for high voltage GIS, could be achieved by analysis simulation. As a result, filling material which is lower permittivity such as $SiO_2$ instead of $Al_2O_3$ properly to the epoxy material, can be improved to increase the electrical insulation performance and mechanical strength for an optimized profile barrier of a high voltage GIS.

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References

  1. A. Luxa, The CAPEIEL Cradle-to-Grave Inventory Methodology for $SF_6$-Insulated Electrical High Voltage Switchgear in Europe (EPA Conference, San Diego, USA, 2002) p. 21-22.
  2. H. H. Daumling and H. Singer, IEEE Trans, on PD., 4, 1 (1989).
  3. B. Y. Lee, IEEE Trans. on PD., 13, 3 (1998).
  4. K. Kato, IEEE Trans. on Dielectrics and Electrical Insulation, 13, 362 (2006). https://doi.org/10.1109/TDEI.2006.1624281
  5. A. Kawamoto, Y. Suzuoki, T. Mizutani, and M. Ieda, Trans. IEEE of Japan, 108, 187-192 (1988).
  6. A. Ahmethodzic, M. Kapetanovic, and Z. Gajic, IEEE Trans. on Dielectrics and Electrical Insulation, 18, 4 (2011). https://doi.org/10.1109/TDEI.2011.6118660