Journal of the Institute of Electronics and Information Engineers (전자공학회논문지)

The Institute of Electronics and Information Engineers (대한전자공학회)
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A Study on the Evaluation Method of Shielding Effectiveness using NFS in Near-Field Tests

근거리장에서 NFS를 사용한 차폐효율 평가방법에 관한 연구

  • Park, Jungyeol (School of Electronic Engineering, Soongsil University) ;
  • Song, Inchae (School of Electronic Engineering, Soongsil University) ;
  • Kim, Boo-Gyoun (School of Electronic Engineering, Soongsil University) ;
  • Kim, Eun-Ha (Korea Automotive Technology Institute)
  • 박정열 (숭실대학교 전자정보공학부) ;
  • 송인채 (숭실대학교 전자정보공학부) ;
  • 김부균 (숭실대학교 전자정보공학부) ;
  • 김은하 (자동차부품연구원)
  • Received : 2015.10.15
  • Accepted : 2016.07.28
  • Published : 2016.08.25
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Abstract

In this paper, we evaluated shielding effectiveness (SE) of carbon nanotube (CNT) film using near field scanning (NFS) in near field analysis. We adopted CNT film with deposit carbon density of 5% and thickness of 1mm for evaluation of shielding characteristic. Using a test coupon analogized to an actual IC package, we measured SE according to measuring position and SE according to distances between the CNT film and the test coupon. As a result, the measured SE in the near field varied with frequency. Especially, the measured electric field SE in the center of the test coupon is better than that of the measured edge point of the test coupon where it is affected by fringing effect. The results show that the measured SE in the near field is affected not only by frequency but also by measurement environment such as position and height of the probe and height of shielding film. In conclusion, we should choose proper methods for SE measurement considering interference distance in the electronic control system because there is little correlation between the proposed evaluation method in the near field and ASTM D 4935-10.

본 논문에서는 근거리장에서 NFS(near field scanning)를 사용한 차폐효율 평가 방법을 통해 CNT(carbon nanotube) 필름의 차폐 특성을 분석하였다. 차폐 특성 평가는 농도 5%와 1mm의 두께를 가지는 CNT 필름과 실제 IC package를 모사한 테스트쿠폰을 사용하여 CNT 필름과 테스트쿠폰과의 거리에 따른 전자파 차폐효율 및 측정 위치에 따른 차폐효율을 측정하였다. 그 결과 근거리장에서 측정된 차폐효율은 주파수에 따라 차폐효율이 달랐다. 테스트쿠폰의 중심에서 측정된 전기장 차폐효율은 fringing effect의 영향을 받는 패턴경계보다 전기장 차폐효율이 좋은 것으로 측정되었다. 이는 근거리장에서 측정된 차폐효율은 주파수뿐만 아니라 CNT 필름과 측정 프로브의 높이, 측정 위치와 같은 측정 환경에 영향을 받는 것을 보여준다. 결론적으로 근거리장에서 제안된 방법을 사용하여 측정한 차폐효율과 ASTM D 4935-10에 의해 측정된 차폐효율은 연관성을 찾기 어렵기 때문에 전장 시스템의 거리 영역에 따라 적절한 측정 방법을 고려하여 측정해야 한다.

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References

  1. G. Zarri, F. Colucci, F. Dupuis, R. Mariani, M. Pasquariello, G. Risaliti, and C. Tibaldi, "On the verification of automotive protocols," IEEE Proceedings of Design, Automation and Test in Europe, vol. 2, p. 6, March 2006.
  2. S. Yamamoto and O. Ozeki, "RF conducted noise measurements of automotive electrical and electronic devices using artificial network," IEEE Transactions on Vehicular Technology, vol. VT-32, no. 4, pp. 247-253, November 1983.
  3. T. C. Lim, "Automotive panel noise contribution modeling based on finite element and measured structural-acoustic spectra," Applied acoustics, vol. 60, pp. 505-519, August 2000. https://doi.org/10.1016/S0003-682X(00)00007-4
  4. S. Wang, F. C. Lee, and W. G. Odendaal, "Cancellation of capacitor parasitic parameters for noise reduction application," IEEE Transactions on Power Electronics, vol. 21, no. 4, pp. 1125-1132. July 2006. https://doi.org/10.1109/TPEL.2006.876782
  5. A. Bhargava, D. Pommerenke, K. W. Kam, F. Centola, and C. W. Lam, "DC-DC buck converter EMI reduction using PCB layout modification," IEEE Transactions on Electromagnetic Compatibility, vol. 53, no. 3, pp. 806-813, August 2011. https://doi.org/10.1109/TEMC.2011.2145421
  6. W. Priebsch and D. Rehder, "Preparation and vanadium-51 NMR characteristics of oxovanadium (V) compounds. Relation between metal shielding and ligand electronegativity," Inorganic Chemistry, vol. 24, pp. 3058-3062, September 1984.
  7. X. Luo and D. D. L. Chung, "Electromagnetic interference shielding using continuous carbon-fiber carbon-matrix and polymer-matrix composites," Composites Part B: Engineering, vol. 30, pp. 227-231, April 1999. https://doi.org/10.1016/S1359-8368(98)00065-1
  8. IEC 61967-3, "Integrated circuits - Measurement of electromagnetic emissions, Part 3: Measurement of radiated emissions-surface scan method," 2nd Edition, August 2014.
  9. IEC 61967-6, "Integrated circuits-Measurement of electromagnetic emissions, 150 kHz-1 GHz- Part 6: Measurement of conducted emissions- Magnetic probe method," 1st Edition, December 2008.
  10. http://www.emcdir.com/menu/pdf/LP1-TEIL4e.pdf
  11. J.-K. Wee, Y.-J. Park, H.-S. Min, D.-H. Cho, M.-H. Seung, and H.-S. Park, "Modeling the substrate effect in interconnect line characteristics of high-speed VLSI circuits," IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 10, pp. 1436-1443, October 1998. https://doi.org/10.1109/22.721145