Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Trasient Liquid Phase bonding for Power Semiconductor

전력반도체 패키징을 위한 Transient liquid phase 접합 기술

  • Roh, Myong-Hoon (Joining and Welding Research Institute, Osaka University) ;
  • Nishikawa, Hiroshi (Joining and Welding Research Institute, Osaka University) ;
  • Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul) ;
  • Kim, Wonjoong (Department of Materials Science and Engineering, University of Seoul)
  • 노명훈 (오사카대학교 접합과학연구소) ;
  • ;
  • 정재필 (서울시립대학교 공과대학 신소재공학과) ;
  • 김원중 (서울시립대학교 공과대학 신소재공학과)
  • Received : 2017.02.08
  • Accepted : 2017.03.14
  • Published : 2017.03.31
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Abstract

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

Keywords

References

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