Composites Research

The Korean Society for Composite Materials (한국복합재료학회)
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A Study on Heat Dissipation Characteristics of PMMA Composite Films with Phase Change Material

상변화물질을 이용한 PMMA 복합필름의 방열 성능 향상에 관한 연구

  • Kwon, Junhyuk (Department of Polymer Science and Engineering, Sungkyunkwan University) ;
  • Yoon, Bumyong (Department of Polymer Science and Engineering, Sungkyunkwan University) ;
  • Cho, Seung-hyun (Department of Energy Science, Sungkyunkwan University) ;
  • Lee, Stephanie K. (Department of Energy Science, Sungkyunkwan University) ;
  • Kim, Hyung-ick (Korean Institute of Industrial Technology) ;
  • Kim, Donghyun (LG Electronics) ;
  • Park, Kyungui (LG Electronics) ;
  • Suhr, Jonghwan (Department of Polymer Science and Engineering, Sungkyunkwan University)
  • Received : 2017.08.07
  • Accepted : 2017.10.29
  • Published : 2017.10.31
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Abstract

The focus of this study is to experimentally investigate the heat dissipation characteristics of poly (methyl methacrylate) (PMMA) composite films with phase change materials (PCM) to resolve heat build-up problems encountered in various electronic devices. In this study, two different types of phase change materials were used to fabricate the composite films by compression molding method and PCM paste sealing method then compared. It was observed in this study that the heat dissipation capability of PCM/PMMA composite films was remarkably enhanced by applying graphite sheet or graphene film into the composite due to their high thermal conductivity. These PCM/ PMMA composite films were attached on the hot spot inside smart phone and tested its surface temperature change according to time. The heat dissipation capability of PCM/PMMA composite film incorporated smart phone was increased 154% and hybrid PCM/PMMA composite film incorporated smart phone was increased 286% over the reference, respectively.

본 연구에서는 전자기기 사용에 이슈가 되고 있는 발열 문제를 해결하고자 상변화물질(PCM)의 잠열 특성을 이용하여 폴리메틸메타크릴레이트(PMMA) 복합필름을 제조하고 방열 성능을 평가하였다. 이를 위해 용융온도가 서로 다른 두 가지의 상변화물질을 사용하여 제작한 PCM/PMMA 복합필름의 열적 특성을 비교 분석하여 다양한 사용조건에 따른 유효성을 검증하였고, Compression Molding 방법과 PCM Paste Sealing 방법에 따른 PCM/PMMA 복합필름의 방열 특성을 비교 분석하여 최대의 방열 효과를 달성할 수 있는 최적의 방법을 도출하였다. 또한 PCM/PMMA 복합필름의 방열 성능을 최대화하기 위해 열전도율이 높은 흑연과 그래핀을 추가로 적층하여 제조한 Hybrid 복합필름의 열적 특성을 분석하였고, 이들을 통해 향상된 방열 성능을 실험적으로 검증하였다. 본 연구를 통해 개발된 방열 성능이 우수한 복합필름은 다양한 전자기기에 활용되어 발열 문제를 효과적으로 해결할 수 있을 것으로 기대된다.

Keywords

References

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