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Effect of Conductive Particles on Electrical Conductivity using EHD Ink Jet Printing Technology

EHD Ink Jet Printing 기술을 이용한 Conductive Particle의 전기전도도에 미치는 영향

  • Ahn, Ju-Hun (Department of Aerospace Engineering, Chosun University) ;
  • Lee, Yong-Chan (Department of Aerospace Engineering, Chosun University) ;
  • Choi, Dae-San (Department of Aerospace Engineering, Chosun University) ;
  • Lee, Chang-Yull (Department of Aerospace Engineering, Chosun University)
  • 안주훈 (조선대학교 항공우주공학과) ;
  • 이용찬 (조선대학교 항공우주공학과) ;
  • 최대산 (조선대학교 항공우주공학과) ;
  • 이창열 (조선대학교 항공우주공학과)
  • Received : 2018.07.02
  • Accepted : 2018.11.29
  • Published : 2018.12.31

Abstract

ACF, which is used for the transparent electrode film is manufactured by the thermocompression method with conductive particles. However, the method has disadvantages since there are many wasted materials and the process is complex. To overcome the demerits of the conventional method, EHD printing technology with conductive particles ink is proposed. The line thickness of patterning is influenced by the characteristics of the inks and the printing conditions. Therefore, it is salient to find the most conducive conditions for the micro patterning. In this paper, the ink with conductive particles was manufactured, and the patterning results were obtained by varying the nozzle thickness and the flow rate. The electrical conductivity according to the ejection of the particles ink is obtained.

투명 전극에 사용되는 필름인 이방성전도필름은 전도성 입자를 재료로 하여 열 압착법으로 제조되고 있다. 하지만 열 압착법은 낭비되는 재료가 많고 공정이 복잡하다는 단점을 가지고 있으며, 이와 같은 단점을 극복하기 위해 전도성 입자 잉크를 이용한 잉크젯 프린팅 기술을 제안하였다. 잉크의 특성 및 프린팅 조건은 패터닝 선 두께에 영향을 주게 되며, 미세 패터닝을 위한 최적 조건 도출이 중요하다. 본 논문에서는 전도성 입자 잉크를 제작하였으며, 노즐의 두께와 유량을 변화하여 패터닝 결과물을 제작하였고, 전도성 입자 잉크의 토출에 따른 전기전도도를 도출하였다.

Keywords

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Fig. 1 Experimental Equipments of EHD Ink Jet Printing

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Fig. 2 Schematic Diagram of EHD Ink Jet Printing System

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Fig. 3 Mechanism of EHD Ink Jet Printing

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Fig. 4 Meniscus Shapes of Nozzle Sizes[(a):27 G, (b):30 G, (c):32 G]

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Fig. 5 Printing Results according to Flow Ratein 27 G Nozzle (X1200) [(a): 5 μl/min, (b): 10 μlmin, (c): 15 μl/min ]

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Fig. 6 Printing Results according to Flow Rate in 30 G Nozzle (X1200) [(a): 5 μlmin, (b): 10 μlmin, (c): 15 μlmin]

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Fig. 7 Printing Results according to Flow Rate in 32 G Nozzle (X1200) [(a): 5 μlmin, (b): 10 μlmin, (c): 15 μlmin]

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Fig. 8 Line Thickness according to Nozzle Size and Flow Rate

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Fig. 9 Micrograph of 22G Nozzle Printing (X1200)

Table 1 Nozzle Sizes for Experiments

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Table 2 Line Thickness with Printing Results

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Table 3 Resistance according to Nozzle Sizes and Flow Rate

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Table 4 Electrical Conductivity according to Nozzle Sizes and Flow Rate

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References

  1. M. J. Yim and K. W. Paik, "Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications," International Journal of Adhesion & Adhesives, vol. 26, no. 5, pp. 304-313, Aug. 2006. https://doi.org/10.1016/j.ijadhadh.2005.04.004
  2. J. S. Park, I. J. Jo and Y. E. Shin, "Thermocompression anisotropic conductive films (ACFs) bonding for flat panel displays (FPDs) application," Journal of the Korean Institute of Electrical and Electronic Material Engineers, vol. 22, no. 3, pp. 199-204, Mar. 2009. https://doi.org/10.4313/JKEM.2009.22.3.199
  3. C. S. Jang, S. Y. Han, J. C. Ryu, S. M. Cio and H. G. Kim, "Issues in assembly process of next-generation fine-pitch chip-on-flex packages for LCD applications," IEEE Trans. of Advanced Packaging, vol. 30, no. 1, pp. 2-10, Feb. 2007. https://doi.org/10.1109/TADVP.2006.890202
  4. W. Jin, "Composite anisotropic conductive film," International Journal of Applied Mechanics and Materials, vol. 302, pp. 182-188, Feb. 2013. https://doi.org/10.4028/www.scientific.net/AMM.302.182
  5. K. H. Kim, S. I. Cho and J. H. Park, "Application of head-up-display technology to telematics," Journal of Electronics and Telecommunications Trends, vol. 23, no. 1, pp. 153-162, Feb. 2008.
  6. K. H. Kim and H. S. Park, "Trends of in-vehicle AR technology," Journal of Electronics and Telecommunications Trends, vol. 28, no. 4, pp. 45-52, Aug. 2013.
  7. J. W. Lim, "A study on the safety of flight(SOF) assure through aircraft diagnostics systems," Journal of The Society for Aerospace System Engineering, vol. 11, no. 1, pp. 35-40, Feb. 2017.
  8. H. G. Jeon, K. H. Lee and Y. B. Lim, "A study on the development of digital head up display for aircraft," Proc. of KSAS Spring Conference 2014, Wonju, Korea, pp. 1082-1085, Apr. 2014.
  9. B. J. Lee and Y. K. Jin, "Design considerations of electronic display in part 23 airplanes," Journal of The Society for Aerospace System Engineering, vol. 7, no. 1, pp. 26-31, Mar. 2013.
  10. J. H. Ahn and C. Y. Lee, "Characteristics comparisons of PVDF and PVDF/PZT composites ejected by electrohydrodynamics ink jet printing," Proc. of SASE 2017 Fall Conference, Busan, Korea, pp. 354-355, Nov. 2017.
  11. J. H. Park, B. S. Kim, S. Y. Kim and J. H. Hwang, "Prediction of drop-on-demand (DOD) pattern size in pulse voltage-applied electrohydrodynamic (EHD) jet printing of Ag colloid Ink," International Journal of Applied Physics a Materials Science and Processing, vol. 117, no. 4, pp. 2225-2234, Dec. 2014. https://doi.org/10.1007/s00339-014-8650-6
  12. J. H. Ahn, Y. C. Lee, D. S. Choi and C. Y. Lee, "BaTiO3 ink manufacturing and ejection using EHD ink jet printing technology," Proc. of SASE 2018 Spring Conference, Jeju, Korea, pp. 432-433, Apr. 2018.
  13. H. D. Lee, Y. J. Jeong, B. S. Lee, S. U. Park, H. T. Yudistira, C. L. Choong, J. J. Park, C. E. Park and D. Y. Byun, "Fabrication of poly (3-hexylthiophene) (P3HT) field-effect transistors by electrohydrodynamic (EHD) jet printing," Proc. of KSME 2014 Fall Conference, Gwangju, Korea, pp. 1563-1556, Nov. 2014.