Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Preparation of n-type Bi-Te-Se-based Thermoelectric Materials with Improved Reliability via hot Extrusion Process

열간압출을 이용한 고신뢰성 n형 Bi-Te-Se계 열전소자 제조

  • Hwang, Jeong Yun (Department of Materials Science and Engineering, Yonsei University) ;
  • Kim, Yong-Nam (Material Technology Center, Korea Testing Laboratory) ;
  • Lee, Kyu Hyoung (Department of Materials Science and Engineering, Yonsei University)
  • 황정윤 (연세대학교 신소재공학과) ;
  • 김용남 (한국산업기술시험원 재료기술센터) ;
  • 이규형 (연세대학교 신소재공학과)
  • Received : 2019.06.13
  • Accepted : 2019.06.27
  • Published : 2019.06.30
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Abstract

Herein we developed the hot extrusion technology to prepare n-type Bi-Te-Se-based thermoelectric materials with high reliability. Starting ingot was fabricated via melt-solidification process, then pulverized it into powders (${\sim}30{\mu}m$) by using high energy ball milling. By optimization of mold design and temperature-pressure conditions for hot extrusion, dense extrudate of 1.8 mm in diameter with high 00l orientation could be obtained from disc-shape compacted powders (20 mm in diameter). High power factor ${\sim}4.1mW/mK^2$ and enhanced mechanical strength ~50 MPa were simultaneously observed at 300 K.

높은 신뢰성의 n형 Bi-Te-Se계 열전소자 제조를 위한 열간압출 공정을 확립하였다. 용융-응고 공정을 이용하여 Bi-Te-Se 원료잉곳을 합성하였으며, 고에너지 볼밀을 이용하여 평균 ${\sim}30{\mu}m$ 크기의 분말로 분쇄하였다. 일축가압 공정으로 분말을 직경 20 mm의 디스크 형태로 성형한 후 압출용 몰드 설계-제작 및 열간압출 공정 온도와 압력을 제어하여 성형체로부터 00l 방향으로 결정 배향된 지름 1.8 mm의 원통형 고밀도 압출체를 제조하였다. 상온에서 최대 ${\sim}4.1mW/mK^2$의 높은 파워팩터를 나타냈으며, zone melting 공정으로 제조한 상용 열전소재와 비교하여 2배 이상 향상된 기계적 강도 (~50 MPa)를 구현하였다.

Keywords

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Fig. 1. Schematic illustration of π-type thermoelectric module.

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Fig. 2. Fabrication process of thermoelectric elements from ingot and extrudate.

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Fig. 3. Design of hot extrusion process.

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Fig. 4. XRD patterns for Cu0.03Bi2Te2.7Se0.3 (a) powders and (b) extrudate.

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Fig. 5. SEM images for the fractured surfaces of Cu0.03Bi2Te2.7Se0.3 extrudate; (a) perpendicular to the extrusion direction and (b) parallel to the extrusion direction.

MOKRBW_2019_v26n2_45_f0006.png 이미지

Fig. 6. Temperature dependences of (a) electrical conductivity and Seebeck coefficient and (b) power factor for Cu0.03Bi2Te2.7Se0.3 extrudate.

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