DOI QR코드

DOI QR Code

Design Study for Power Integrity in Mobile Devices

모바일 기기의 전원 무결성을 위한 설계 연구

  • Received : 2019.09.18
  • Accepted : 2019.10.15
  • Published : 2019.10.31

Abstract

Recently, mobile devices have evolved into small computers with various functions according to user requirements. Careful attention must be paid to the design of the power supply network for the stable operation of the application processor (AP), the wireless communication modem, the high performance camera, and the various interfaces of the mobile device to implement various functions of the mobile device. In this paper, we analyzed and verified the method of optimizing the design parameters such as the position, capacity, and number of decoupling capacitors to meet the target impedance required by the driver IC chip to ensure the stability of the power supply network of mobile devices that should be designed as wiring type due to mounting density limitation. The proposed wired power supply network design method can be applied to various applications including high-speed signal transmission line in addition to mobile applications.

최근 모바일 기기는 사용자 요구에 따라 다양한 기능이 있는 소형 컴퓨터의 형태로 발전하였다. 모바일 기기의 다양한 기능을 구현하기 위해 실장되는 AP(: Application processor)와 무선통신용 모뎀 및 고성능 카메라 외 다양한 인터페이스를 위한 IC 들의 안정적인 동작을 위해서는 전원 공급 네트워크 설계에 주의가 필요하다. 본 논문에서는 실장 밀도 제한으로 인해 배선형으로 설계해야하는 모바일 기기의 전원 공급 네트워크의 안정성 확보를 위해 드라이버 IC 칩에서 요구하는 목표 임피던스를 만족하도록 디커플링 캐패시터의 위치, 용량, 개수 등의 설계 파라메터를 최적화하는 방법에 대해 분석하고 시뮬레이션을 통해 검증하였다. 본 논문을 통해 제안된 배선형 전원 공급 네트워크 설계 방법은 모바일 어플리케이션 외 고속신호 전송선로가 포함되는 다양한 응용분야에 확대 적용될 수 있을 것으로 판단된다.

Keywords

References

  1. G. Sa and Y. Lim, "Study on Design Criteria of HDMI Transmission Line according to Surface Roughness of Printed Circuit Board Wiring Material," J. of Korea institute of electronic communication science, vol. 14, no. 2, 2019, pp. 289-296. https://doi.org/10.13067/JKIECS.2019.14.2.289
  2. Y. Jeon, B. Song, J. Kim, J. Park, and Y. Yu, "Implementation of Automotive Multimedia Interface Supporting Multi-Channel Display in Multi-Screen Display," J. of Korea institute of electronic communication science, vol. 8, no. 1, 2013, pp. 199-206. https://doi.org/10.13067/JKIECS.2013.8.1.199
  3. G. Sa, S. Kim, and Y. Lim, "Design of Ultra Small Dual Cross-dipole Antenna for mobile devices," J. of Korea institute of electronic communication science, vol. 14, no. 3, 2019, pp. 489-496. https://doi.org/10.13067/JKIECS.2019.14.3.489
  4. G. W. Peterson, J. L. Prince, and K. L. Virga, "Investigation of Power/Ground Plane Resonance Reduction Using Lumped RC Elements," IEEE Int. Conf. on Electronic Components and Technology, Las Vegas NV, USA, 2001.
  5. J. Mao, C. Wang, and G. Selli, "Memory DIMM DC Power Distribution Analysis and Design," IEEE Int. Conf. on Electronic Components and Technology, Las Vegas NV, USA, 2000.
  6. P. Zhou, K. Sridharan, and S. S. Sapatnekar, "Optimizing Decoupling Capacitors in 3D Circuits for Power Grid Integrity," IEEE J. of Design & Test of Computers, vol. 26, no. 5, 2009, pp. 15-25. https://doi.org/10.1109/MDT.2009.120
  7. S. W. Guan, C. W. Kuo, C. C. Wang, and T. Kitazawa, "Power and signal integrity co-design for quad flat non-lead package," IEEE L. of Electronics, vol. 48, no. 15, 2012, pp. 942-943. https://doi.org/10.1049/el.2012.0494
  8. W. Shenglong, S. Ling, S. Haiyan, Y. Lingling, Z. Boyuan, and L. Junwei, "Relationship between SSN and EMC in SiP," IEEE Int. Con. on Electronic Packaging Technology, Dalian, China, 2013.
  9. S. Huh, D. Chung, and M. Swaminathan, "Near zero SSN power delivery networks using Constant Voltage Power Transmission Lines," IEEE Int. Symp. on Electrical Design of Advanced Packaging & Systems, Hong Kong, China, 2009.
  10. J. Kim, E. Park, J. Lee, K. Park, and Y. Park, "Novel target impedance for power distribution network of simultaneous switching output (SSO) buffers," IEEE Int. Symp. on Electrical Design of Advanced Packaging & Systems, Bangalore, India, 2014.
  11. Y. Chung, S. Kang, and Y. Joung, "Analysis of process parameters on cell capacitances of memory devices," J. of Korea institute of electronic communication science, vol. 12 no. 5, 2017, pp. 791-796. https://doi.org/10.13067/JKIECS.2017.12.5.791
  12. M. Hua, N. Minxi, T. Anju, and M. Jianghong, "Power and Signal Integrity Analysis of High-speed Mixed-signal Backplanes Based on VPX," IEEE Int. Symp. on Electromagnetic Compatibility, Signal Integrity and Power Integrity, Long Beach, CA, USA, 2018.