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A Study on the Release Characteristics During Wafer-Level Lens Molding Using Thermosetting Materials

열경화성 소재를 사용한 웨이퍼 레벨 렌즈 성형 중 이형 특성에 관한 연구

  • Received : 2020.10.07
  • Accepted : 2021.01.08
  • Published : 2021.01.31

Abstract

Among the defect factors that can occur when a wafer-level lens is molded using a thermosetting material, the mold sticking problem of a molded lens during the release process can damage the molded substrate and deform the substrate at the wafer level. An experiment was conducted to examine the factors affecting the demolding force in the lens forming process. The demolding force was examined according to the coating material of the molds. The mold was surface-treated with ITO and Ti, followed by plasma treatment in an O2 atmosphere. A DLC coating was then performed, and the curing and releasability were examined. A coating method for the pull-off experiment was selected based on the results. To measure the demolding force according to the curing process conditions, a method of curing at a constant pressure and a method of curing at a constant position were applied. As a result, the TiO2 surface treatment reduced the release force. When cured by controlling the location, curing shrinkage can reduce the adhesion energy of the interface during curing, resulting in better demolding.

열경화성 소재를 이용하여 열경화방식의 웨이퍼 레벨 렌즈를 성형할 때 발생될 수 있는 불량요인 중 이형과정에서 성형 렌즈의 금형 고착문제는 웨이퍼 레벨에서 성형된 기판의 파손 및 기판의 변형으로 성형된 웨이퍼 기판의 적층시 웨이퍼 양면의 렌즈 형상 및 센터 정렬 오차에 영향을 미친다. 본 연구에서는 웨이퍼 레벨 렌즈 성형 공정에서 이형력에 영향을 미치는 인자를 검토하기 위한 실험을 수행하였다. 먼저 상·하 금형의 코팅 재질에 따른 이형력을 검토하기 위하여 금형 표면을 ITO 및 Ti로 표면처리 후 O2분위기에서 플라즈마 처리하였고, 또한 DLC 코팅도 진행하였으며 경화 및 이형성을 검토하였다. 그 결과를 바탕으로 pull-off 실험을 위한 코팅방법을 선정하였다. 또한 경화공정조건에 따른 이형력을 측정하기 위하여 압력을 유지하면서 경화시키는 방법과 일정한 간격을 유지하면서 경화시키는 방법을 실험적으로 적용하였다. 그 결과 Ti 코팅 후 O2 플라즈마 표면처리 방법이 이형력을 감소시키고 위치를 제어하면서 경화시킬 경우 경화수축에 의해 경화 중 계면의 접착에너지를 감소시켜 보다 나은 이형이 될 수 있음을 확인하였다.

Keywords

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