Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effects of Temperature/Humidity Treatment Conditions on the Peel Strength between Screen-printed Ag and Polyimide Films

고온/고습 조건이 스크린 프린팅 Ag와 Polyimide의 필 강도에 미치는 영향

  • Lee, Hyeonchul (STATS ChipPAC Korea Ltd.) ;
  • Bae, Byeong-Hyun (VITZROTECH Co., Ltd.) ;
  • Son, Kirak (DMC Convergence Research Department, Electronics and Telecommunications Research Institute) ;
  • Kim, Gahui (School of Materials Science and Engineering, Andong National University) ;
  • Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
  • 이현철 ((주)스태츠칩팩코리아) ;
  • 배병현 ((주)비츠로테크) ;
  • 손기락 (한국전자통신연구원 DMC융합연구단) ;
  • 김가희 (안동대학교 신소재공학부 청정에너지소재기술연구센터) ;
  • 박영배 (안동대학교 신소재공학부 청정에너지소재기술연구센터)
  • Received : 2022.05.06
  • Accepted : 2022.05.23
  • Published : 2022.06.30
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Abstract

Effect of temperature/humidity (T/H) treatment conditions on the peel strength of screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90° peel test. Initial peel strength was 25.99±1.47 gf/mm, and then decreased to 6.05±0.54 gf/mm after 500 h at 85℃/85% relative humidity T/H condition. And, the peeled locus was changed from Ag/PI interface to shallow cohesive inside PI near interface. X-ray photoelectron spectroscopy analysis on the peeled surfaces showed that the long-term moisture penetration into the Ag/PI interface during T/H treatment led to hydrolytic degradation of PI to form weak boundary layer inside PI near Ag/PI interface, which are responsible for large decrease in peel strength.

인쇄전자소자의 금속배선 적용을 위해 스크린 프린팅 Ag/폴리이미드(polyimide, PI) 사이의 계면접착력을 85℃/85% 상대습도의 고온/고습 처리 시간에 따라 PI 필링을 통한 90° 필 테스트로 평가하였다. 고온/고습 처리 전 필 강도는 약 25.99±1.47 gf/mm이었고, 500시간 동안 고온/고습 처리 후 필 강도는 6.05±0.54 gf/mm까지 지속적으로 감소하였다. 박리 파면에 대해 X-선 광전자 분광법 분석 결과, 이는 Ag/PI 계면으로 수분이 지속적으로 침투하여 계면 근처 PI 일부가 가수분해되어 weak boundary layer를 형성하기 때문이고, 이로 인해 고온/고습 처리 전 Ag/PI 계면 박리모드가 고온/고습 처리 후 계면 근처 PI의 얕은 내부 박리 모드로 변경된 것으로 판단된다.

Keywords

Acknowledgement

본 연구는 2022년도 산업통상자원부 및 산업기술평가관리원(KEIT) 연구비 지원에 의한 연구(20016465와 20017189)와 2022년도 정부(산업통상자원부)의 재원으로 한국산업기술진흥원의 지원을 받아 수행된 연구(P0008458, 2022년 산업혁신인재성장지원사업) 결과로 수행되었습니다.

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