• Korean Journal of Food Science and Technology
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• v.28 no.2
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• pp.212-219
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• 1996

Four-dimensional response surface methodology was used for monitoring dynamic changes in substrates during Maillard reaction. The coefficients of determination ($R^2$) of response surface regression equations for the changes in amino acids during Maillard reaction were 0.9478 for total amino acids and above 0.90 for each amino acid. $R^2$ of regression equations for the changes in sugars during Maillard reaction were 0.9250 for glucose and 0.6490 for fructose. The contents of total amino acids gradually decreased with increasing reaction temperature and pH of the solvent. Browning color intensity increased with rising reaction temperature, showing maximum color intensity at around $145^{\circ}C$. Each amino acid showed a decreasing tendency in its contents, which was similarly found in total amino acids. Four-dimensional response surface methodology indicated that the increased temperature during Maillard reaction was the most influential factor in decreasing substrates, such as aspartic acid, threonine and glucose. While the reaction time and pH of solvent little affected the changes in the above-mentioned substrates during Maillard reaction.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Journal of the Korean Society of Food Science and Nutrition
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• v.26 no.4
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• pp.654-661
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• 1997

Response surface methodology was applied to monitor dynamic changes in free sugars and free amino acids associated with browning reaction during roasting of Polygonatum odoratum roots. Second-order model for qualities of water- soluble extracts was employed to generate contour maps and response surfaces. Browning color intensity of water-soluble extracts was increased with the roasting time up to around 14$0^{\circ}C$, but decreased in increasing temperature above L6O"C. Free sugars, mainly composed of sucrose and fructose, were remarkably decreased at roasting under the higher temperature and longer time, while glucose linearly increased with the increase of roasting temperature up to 15$0^{\circ}C$. Most of free amino acids was decreased in their amounts in Proportion to the roasting temperature and time, while threonine and lysine were insignificantly increased under the roasting conditions at above 17$0^{\circ}C$ and 60min.0min.

• Asian-Australasian Journal of Animal Sciences
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• v.18 no.7
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• pp.990-996
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• 2005

The effect of diets varying in level and source of nitrogen (N) and fermentable organic matter on dynamic characteristics of microbial populations in rumen liquor and their impact on substrate fermentation in vitro was studied. The diets tested were straw alone, straw+concentrate mixture and straw+urea molasses mineral block (UMMB) lick. The same diets were taken as substrates and tested on each inoculum collected from the diets. Diet had no effect on the amino acid (AA) composition of either bacteria or protozoa. Differences among the diets in intake, source of N and OM affected bacterial and protozoal characteristics in the rumen. Upper asymptote of gas production (Y$\alpha$) had a higher correlation with bacterial pool size and production rate than with protozoal pool size and production rate. Among the parameters of the gas production model, Y$\alpha$ and lag time in total gas has showed significant (p<0.01) correlation with bacterial characteristics. Though the rate constant of gas production significantly differed (p<0.01) between diet and type of straw, it was least influenced by the microbial characteristics. The regression coefficient of diet and type of straw for Y$\alpha$ indicated that the effect of diet on Y$\alpha$ was threefold higher than that of the straw. As microbial characteristics showed higher correlation with Y$\alpha$, and diet had more influence on the microbial characteristics, gas production on a straw diet could be used effectively to understand the microbial characteristics.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.40 no.6
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• pp.350-355
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• 2007

The optimal substrates and reaction flavoring conditions were examined to develop pearl oyster extract (POE) flavor using the Maillard reaction under a model system. The sugar for the Maillard reaction was glucose, and the amino acid was cysteine, with glycine as the reaction substrate. A three-dimensional response surface method was used to monitor the dynamic changes of the substrates during the Maillard reaction. To enhance the flavor of POE, a two-step enzymatic hydrolysate (Brix $20^{\circ}$) was reacted with the precursors (1:1, v/v). A 2:1:1 mixture of 0.4 M glucose:0.4 M glycine:0.4 M cysteine (v/v) was selected as a suitable reaction system for the reappearance of baked potato odor and boiled meat odor, and masking the shellfish odor. The two-step enzymatic hydrolysate and selected precursors were reacted in a high-pressure reactor to optimize the reaction parameters. The optimum conditions were 150 minutes at $120\;^{\circ}C$ and pH 7.0. The pH was the most critical factor for the response of the baked potato odor and masking the shellfish odor, while the reaction time affected the reappearance of the boiled meat odor.

• Korean Journal of Materials Research
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• v.10 no.3
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• pp.184-190
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• 2000

We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Composites Research
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• v.24 no.1
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• pp.45-50
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• 2011

Transparent and conductive carbon nanotube on polyethylene terephthalate (PET) were prepared by dip-coating method for self-sensing multi-functional nanocomposites. The changes in the electrical and optical properties of CNT coating mainly depended on the number of dip-coating, concentration of CNT solution. Consequently, the surface resistance and transmittance of CNT coating were sensitively controlled by the processing parameters. Surface resistance of CNT coating was measured using four-point method, and surface resistance of coated CNT could be better calculated by using the dual configuration method. Optical transmittance of PET film with CNT coating was evaluated using UV spectrum. Surface properties of coated CNT investigated by wettability test via static and dynamic contact angle measurement were consistent with each other. As dip-coating number increased, surface resistance of coated CNT decreased seriously, whereas the transmittance exhibited little lower due to the thicker CNT networks layer. Interfacial microfailure properties were investigated for CNT and indium tin oxide (ITO) coatings on PET substrates by electrical resistance measurement under cyclic loading fatigue test. CNT with high aspect ratio exhibited no change in surface resistance up to 2000 cyclic loading, whereas ITO with brittle nature showed a linear increase of surface resistance up to 1000 cyclic loading and then exhibited the level-off due to reduced electrical contact points based on occurrence of many micro-cracks.