REOXIDATION법을 이용한 Si WAFER의 HOLE TRAP의 제거

Elimination of Hole Traps on Si Wafer using Reoxidation method

  • 홍순관 (서울시립대학교 전자공학과 반도체실험실) ;
  • 주병권 (서울시립대학교 전자공학과 반도체실험실) ;
  • 김철주 (서울시립대학교 전자공학과 반도체실험실)
  • 발행 : 1987.07.03

초록

Thermal reoxidation was carried out to eliminate hole traps at the surface of Si wafer. As the result, the good surface state of wafer was obtained and hole traps were eliminate at the inversion layer. For the evaluation of reoxidation effects. MOS diode was fabricated and its C-Y curve was plotted.

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