Heat Transfer Characteristics depending on the Length of a Plate with Pin-Fin Array in a Horizontal Channel

수평채널에서 핀-휜을 가진 평판의 길이변화에 따른 열전달 특성

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.